Apple Inc.

Advanced Micro Devices Corporation

Vasu P Ganti

Bo Yang

Michael R Seningen

Amitava Majumdar

Antonietta Oliva

Vijay M Bettada

Anh T Hoang

David A Karol

Ravi Karapatti Ramaswami

Date Jw Noorlag

Heon C Kim

Scott D Hector

An apparatus includes a first set of scan-enabled flip-flop circuits may be configured to shift a scan-chain pattern from a first test input node to a first test output node using a first clock signal. A particular lockup latch may be coupled to the first test output node and to a second test input node. This particular lockup latch may be configured to, when enabled, delay propagation of the scan-chain pattern from the first test output node to the second test input node. A second set of scan-enabled flip-flop circuits may be configured to shift the scan-chain pattern from the second test input node to a second test output node using a second clock signal, different from the first clock signal. A control circuit may be configured to determine whether to enable the particular lockup latch using a particular scan test signal.

Scan data transfer circuits for multi-die chip testing

Systems and methods are provided for detecting defects caused by cracks in an integrated circuit, which may arise during or after a silicon wafer is singulated into separate integrated circuits. An integrated circuit may include crack detection circuitry including a metal circuit. The metal circuit may fracture or break due to crack propagation through a portion of the integrated circuit. In the event of a crack, testing may detect the fracture of the metal circuit. The crack detection circuitry may also detect accurate operation of circuitry of the integrated circuit.

Systems and methods for silicon crack detection structure

An apparatus includes a plurality of circuit blocks, a plurality of scan-enabled flip-flop circuits, and a plurality of scan signature circuits. The plurality of scan-enabled flip-flop circuits may be coupled in a sequential manner across the plurality of circuit blocks, and be configured to shift a scan chain test signal from a test input interface to a test output interface. The plurality of scan signature circuits may be coupled to respective ones of a subset of the plurality of scan-enabled flip-flop circuits, and be configured to, in response to a particular test signal, concurrently load a known scan-chain pattern to the subset of the scan-enabled flip-flop circuits. The plurality of scan-enabled flip-flop circuits may be further configured to sequentially output at least a portion of the known scan-chain pattern to the test output interface.

Scan chain analysis using predefined capture signature

A system and method for efficiently performing timing characterization of regions of an integrated circuit. An integrated circuit has monitors distributed in different physical regions across its die. Each monitor includes timing characterization and self-test circuitry. This circuitry includes one or more tunable delay lines used during timing measurements. The circuitry verifies the tunable delay lines are defect free prior to the timing measurements. If defects are detected, but tunable delay lines may still be used, a scaling factor may be generated for a failing tunable delay line. The scaling factor may be used during subsequent timing measurements to maintain a high accuracy for the measurements. The timing measurements may determine a particular physical region of the die provides fast or slow timing values. The resulting statistics of the timing measurements may be used to change an operational mode of the IC in at least the particular region.

Test circuit and methods for speed characterization

An integrated circuit device includes a plurality of functional tiles. Each functional tile may be configured into a scan chain. A clock generator is operable to generate an internal clock signal that is distributed to each of the functional tiles. A clock gater is associated with each of the functional tiles. Each clock gater is operable to receive an external enable signal and the internal clock signal, generate a scan clock signal for loading a test pattern into the scan chain based on the external enable signal and the internal clock signal, and generate at least one capture clock signal for capturing a response of the tile to the test pattern responsive to identifying the loading of the test pattern.

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Los Altos, CA, United States of America

Vasu P Ganti