Texas Instruments Corporation

Varun Singh

Devanathan Varadarajan

Rejitha Nair

Ramakrishnan Venkatasubramanian

Venkateswar Reddy Kowkutla

John Chrysostom Apostol

David Matthew Thompson

Chunhua Hu

Jose Luis Flores

Ritesh Dhirajlal Sojitra

Siva Srinivas Kothamasu

Kazunobu Shin

Raghavendra Santhanagopal

Anthony Frederick Seely

Sai Karthik Rajaraman

Charles Gerlach

Santhanagopal Raghavendra

A circuit device is provided and includes a first power domain comprising a universal serial bus (USB) subsystem and/or a memory controller subsystem. The first power domain is configured to isolate the USB subsystem and/or the memory controller subsystem from a power-on-reset signal asserted during a low power mode.

Power-on-reset signal isolation during lower power mode

One example includes an integrated circuit (IC). The IC includes non-volatile memory and logic. The logic is configured to receive repair code associated with a memory instance and assign a compression parameter to the repair code based on a configuration of the memory instance. The logic is also configured to compress the repair code based on the compression parameter to produce compressed repair code and to provide compressed repair data that includes the compressed repair code and compression control data that identifies the compression parameter. A non-volatile memory controller is coupled between the non-volatile memory and the logic. The non-volatile memory controller is configured to transfer the compressed repair data to and/or from the non-volatile memory.

Non-volatile memory compression for memory repair

An integrated circuit comprises a set of processor cores, wherein each processor core of the set of processor cores includes BIST logic circuitry and multiple memory blocks coupled to the BIST logic circuitry. Each processor core further includes multiple power control circuitry, where each power control circuitry of the multiple power control circuitry is coupled to a respective processor core of the set of processor cores, multiple isolation circuitry, where each isolation circuitry of the multiple isolation circuitry is coupled to a respective processor core of the set of processor cores, a built-in-self repair (BISR) controller coupled to the each of the set of processor cores, each of the multiple power control circuitry, and each of the multiple isolation circuitry, and a safety controller coupled to the BISR controller, the multiple power control circuitry, and to the multiple isolation circuitry.

Distributed mechanism for fine-grained test power control

An electronic device comprising one or more subcircuits configured to receive a clock signal, the clock signal configured to switch from a reference clock signal to a second clock signal based on a clock bypass signal, a timer configured to receive the reference clock signal and output an alignment signal based on the reference clock signal, wherein a frequency of the alignment signal is determined based on clock frequencies of the one or more subcircuits; a clock alignment module coupled to the timer and the one or more subcircuits and configured to receive the clock bypass signal, determine that the clock bypass signal has changed to switch the one or more subcircuits to the reference clock signal from the second clock signal, block the clock signal from being received by the one or more subcircuits, receive the alignment signal, and unblock the clock signal based on the alignment signal.

Technique for clock alignment supporting reset isolation

In a described example, an integrated circuit (IC) includes a repairable memory system. A repair controller is coupled to the repairable memory system. The repair controller includes compression logic configured to encode memory repair code data for a respective instance of the repairable memory system and provide compressed repair data. A non-volatile memory controller is coupled to the repair controller and to non-volatile memory. The non-volatile memory controller is configured to transfer the compressed repair data to the non-volatile memory for storage.

Built-in memory repair with repair code compression

A system includes a processor and a memory set coupled to the processor. The system also includes a repair circuit coupled to the memory set. The repair circuit includes a first repair circuit and a second repair circuit. The repair circuit also includes a test controller configured to select between the first repair circuit and the second repair circuit to perform an in-field self-repair of the memory set.

Management of multiple memory in-field self-repair options

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Plano, TX, United States of America

Varun Singh