Cisco Technology, Inc.

Varoujan Malian

Mudasir Ahmad

Steven C Bird

Charles H Casale

Danlu Tang

Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (&#x3bc;Via) having a conductive dome disposed above the outer layer pad of the &#x3bc;Via. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

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San Jose, CA, United States of America

Varoujan Malian