Applied Materials, Inc.

Varoujan Chakarian

Sidharth Bhatia

Zhaozhao Zhu

Jeffrey Yat Shan Au

Upendra V Ummethala

Blake Erickson

Vivek Bharat Shah

Chenfei Hu

Nicholas Ryan Pica

A method includes receiving, by a processing device, first data from an optical sensor of a processing chamber. The method further includes processing the first data to obtain second data. The second data includes an indication of a condition of a coating on an interior surface of the processing chamber. The method further includes generating an indication of performance of a processing operation of the processing chamber in view of the second data. The method further includes causing performance of a corrective action in view of the indication of performance of the processing chamber.

Process characterization and correction using optical wall process sensor (OWPS)

A method includes receiving, by a processing device, first sensor data indicating a state of a wall corresponding to a first processing chamber. The first sensor data includes optical spectral data. The method further includes determining, by the processing device, a first value based on the first sensor data. The first value corresponds to a first amount of a product disposed along a surface of the wall at a first time. The method further includes determining, by the processing device, a first update to a first process operation associated with the first processing chamber based on the first value. The method further includes performing, by the processing device, one or more of (i) preparing a notification indicating the first update for presentation on a graphical user interface (GUI), or (ii) causing performance of the first process operation in accordance with the first update.

A method includes grouping signal traces based on signal trace characteristics. The method includes generating an image, a first dimension of the image corresponding to the signal traces, and a second dimension of the image corresponding to time values, where a visual indicator corresponds to a signal trace characteristic of a signal trace at a time value, the signal trace corresponds to a row or column of the first dimension, and the time value corresponds the second dimension. The method includes detecting a defect in operation of components of manufacturing equipment associated with the signal traces based on a deviation of visual indicators in a row or column from a visual indicator of a respective group of visual indicators associated with signal traces with similar signal trace characteristics. The method includes classifying the defect based on a signal trace corresponding to the row or column of the image.

Method for image-based sensor trace analysis

The disclosure describes apparatus and method for detecting an endpoint in plasma-assisted wafer processing in a chamber. A fiber array comprising a plurality of fibers collects optical emission light from the chamber during the plasma-assisted wafer processing. The fiber array is split into two or more groups of fibers, each group carrying a portion of the light to a segment of a photodetector. Each segment of photodetector has a corresponding narrowband optical filter designed for a specific range of wavelengths. A computer processor analyzes detected signals from the plurality of segments of the photodetector, and determines, based on the analysis of the detected signals, an endpoint of the plasma-assisted wafer processing as indicated by the presence or the absence of the one or more chemical species in the chamber. The photodetector can be based on photomultiplier tube (PMT) array or based on photodiodes (e.g., avalanche photodiodes (APDs)).

Low open area and coupon endpoint detection

A concentration sensor assembly can include a vaporization chamber having a compound. The concentration sensor assembly may include a first flow path coupled to the vaporization chamber. The first flow path may direct a first gas to the vaporization chamber. A second flow path can direct a second gas out of the vaporization chamber. The second gas can include the compound and the first gas. A first sensor is disposed along the first flow path. The first sensor measures first data indicative of a first mass flow rate of the first gas. A second sensor is disposed along the second flow path. The second sensor measure second data indicative of a second mass flow rate of the second gas. A computing device may determine a concentration of the vaporizable substance within the second gas based on the first data and the second data.

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San Jose, CA, United States of America

Varoujan Chakarian