Cooper Industries, Inc.

Cooper Technologies Company

Cooper Technologies, Inc.

Varinder Kumar Kalra

Keith Allen Spalding

Joan L Winnett

Stephen J Whitney

Vernon Raymond Spaunhorst

Hundi Panduranga Kamath

Daniel Minas Manoukian

Farid Ghaderi

Peter York So

Russell Brown

Jeffrey Lynn Hollinsworth

Randy John Bicknese

Joan Leslie Bender

Conrad M Reeder

Overcurrent protection fuses with end cap assemblies amenable to automated manufacturing techniques and providing arc burn through resistance when the fusible element opens therein. The end cap assemblies may include washers having arc resistant compositions and may include single or double end cap constructions. Fuse rejection features may be formed in one of the end caps and may create an empty space in the end cap when assembled to a fuse body.

Fuse and arc resistant end cap assembly therefor

A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.

Low resistance polymer matrix fuse apparatus and method

In an exemplary embodiment, a fuse body includes a first end, a second end and a bore extending therethrough for receiving a fuse element assembly. The bore includes a clearing portion having a first cross sectional area and a positioning portion having a second cross sectional area. The first cross sectional area is larger than the second cross sectional area. The positioning portion provides a receptacle for receiving the fuse element assembly and ensuring that the fuse element is substantially centered within the clearance portion.

Fuse element positioning body

A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.

Surface mount standoff for printed circuit board assembly

A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations close the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded. One of a solder and brazing preform bond the fuse element to the end terminations.

Subminiature fuse and method for making a subminiature fuse

A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations form hermetic seals closing the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element diagonally disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded. One of a solder and brazing preform bond the fuse element to the end terminations.

A subminiature circuit protector includes a plurality of layers of ceramic material in a laminate structure, each layer bearing a fuse element. The ends of laminate structure are coated with electrically conductive end terminations. The fuse elements of the layers may be connected in parallel, with fuse elements on each layer connecting to both end terminations, or interconnected in series from one end termination to the other. Each of the fuse elements of the individual layers may comprise two or more individual fuse elements connected in series or in parallel. A method for manufacturing the circuit protector in accordance with the invention includes the steps of printing a multiplicity of fuse elements on a plurality of substrates, stacking the substrates to form a laminate structure, cutting the laminate into individual units, and coating the opposite ends of the units with electrically conductive material to form end terminations.

Ceramic chip fuses with multiple current carrying elements and a method

A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.

Method of making wire element ceramic chip fuses

The improved fuse assembly includes a trigger assembly having an electrically nonconductive barrel for receiving a spring loaded trigger therein and a heater strip disposed along the outer circumferential surface of the barrel with a pair of end flaps. One end flap has a hole therethrough which fits over the end of the trigger adjacent the short circuit element. A second flap fits over the end of the barrel adjacent the end ferrule. The short circuit element, which is electrically and mechanically linked to a ferrule on the opposite end of the tube from the trigger assembly, engages the trigger and heater element in a solder fusing alloy.

Fuse assembly

A spiral wound sand fuse has a non-reactive fiber core permitting use of the fuse to interrupt high fault currents in high voltage circuits.

Spiral wound sand fuse

A method of manufacturing a fuse includes wrapping the fuse element on an insulating bridge. The ends of the bridge include a metal foil coating which helps increase the conductivity and reliability of the solder bond between the fuse element and end ferrule.

Growing community of inventors

Chesterfield, MO, United States of America

Varinder Kumar Kalra