International Business Machines Corporation

Varaprasad Venkata Calmidi

Sanjeev Balwant Sathe

Randall Joseph Stutzman

David James Alcoe

William Louis Brodsky

Krishna Darbha

Donald Seton Farquhar

Eric A Johnson

Michael Joseph Klodowski

Jamil A Wakil

Anandaroop Bhattacharya

An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.

Thermally enhanced lid for multichip modules

Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.

Electronic package with thermally-enhanced lid

A platen for use in a laminating press is provided which includes a body of material having first and second faces and spaced first and second ends. Preferably, at least one heating device is disposed in the body of material. First and second spaced cooling channels are formed in the body of material, the first cooling channel being adjacent the first face and having a fluid inlet port adjacent to or in the first end, and a fluid outlet port adjacent to or in the second end, and a second cooling channel being adjacent the second face and having a fluid inlet port adjacent to or in said second end, and a fluid outlet port adjacent to or in the first end. The invention also contemplates using such platens for laminating a book or stack of sheets of material to form a unitary single member having reduced stresses.

Platen for use in laminating press

A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.

Liquid metal thermal interface for an electronic module

A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.

Electronic package with thermally conductive standoff

A heat sink structure is formed by stacking a plurality of heat sink layers. Each layer comprises an array of vertically disposed heat dissipating elements extending from a base plate. Cut outs are formed in each of the base plates to form openings so that when the layers are stacked, each of the ascending successive layers has a larger opening than the layer upon which it rests. Cooling may be by forced air or natural convection. With forced air, air impinges on the top of the stack and into the opening in the base plates. Because of diminishing size of the openings in the stack, a portion of the air is forced out the sides of each layer. With natural convection, air is drawn into the sides of each layer and the hot air at the center flows upwardly through the openings with increasing volume as it rises.

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Vestal, NY, United States of America

Varaprasad Venkata Calmidi