Endicott Interconnect Technologies, Inc.

Varaprasad V Calmidi

Sanjeev Sathe

Ashwinkumar C Bhatt

James J McNamara, Jr

David James Alcoe

David V Caletka

A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.

Flexible circuit electronic package with standoffs

An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer includes a compressible, resilient member (e.g., an elastomeric pad) and a plurality of thin, metallic sheets (e.g., copper foils) and the thickness thereof can be adjusted by altering the number of such foils.

Adjustable thickness thermal interposer and electronic package utilizing same

A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.

Method of inspecting articles using imaging inspection apparatus with directional cooling

A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.

Method of making wirebond electronic package with enhanced chip pad design

A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.

Method of making an imaging inspection apparatus with improved cooling

An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.

Imaging inspection apparatus with improved cooling

An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.

Imaging inspection apparatus with directional cooling

A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.

Growing community of inventors

Binghamton, NY, United States of America

Varaprasad V Calmidi