Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Vanessa Stenchly

Ulrich Hofmann

Hans-Joachim Quenzer

Hans Joachim Quenzer

Wolfgang Reinert

Arne Veit Schulz-Walsemann

Amit Kulkarni

Norman Laske

Dirk KÄHLER

A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.

Method for producing lens elements and packaged radiation-sensitive devices on wafer level

The invention relates to a MEMS mirror assembly for detecting a large angular range up to 180&#xb0;, preferably up to 160&#xb0;, and to a method for producing a MEMS mirror assembly. The mirror assembly comprises a carrier substrate (), on which a mirror () vibrating about at least one axis is mounted, a transparent cover (), which is connected in a hermetically sealed manner to the carrier substrate () and which comprises an ellipsoidal dome () having a substantially round base area, and a compensation optical system (), which is arranged in a predefined beam path for an incident beam outside the dome (). The middle of the mirror () lies in the centre point of the dome, and the compensation optical system () collimates the incident beam in such a way that a divergence or convergence of the beam caused by the boundary surfaces of the dome once said beam has exited from the dome () is substantially compensated. The MEMS mirror assemblies are produced by joining a cover wafer and a mirror wafer, which each comprise a plurality of hemispherical domes and mirrors mounted on the carrier substrate. The mirror assemblies are then separated from the joined wafers. The domes of the cover wafer are produced by a glass flow process.

MEMS mirror arrangement for detecting a large angular range

The invention relates to a method for producing optical components, wherein a first contact surface is formed by bringing a deformation element into contact with a carrier; and a second contact surface is formed by applying a functional element to the deformation element; said second contact surface at least partially overlapping the first contact surface, so that a deformation zone is formed by the area of the deformation element that lies between the overlapping areas of the two contact surfaces, wherein at least one portion of the deformation zone is heated and deformed in such a way that the functional element is deflected, in particular, shifts and/or tilts, and the functional element is joined with the deformation element during the process step of applying the functional element to the deformation element and/or during the process step of heating and deforming the deformation zone.

Method for producing optical components using functional elements

The method according to the invention is used for producing optical components, in particular covers for encapsulating micro-systems, wherein at least one reinforcing element, which is produced before being arranged, is arranged on a first substrate, as a result of which a stack is produced. This stack is heated after being connected to a second substrate, as a result of which the first substrate is deformed such that at least one region, covered by the reinforcing element, of the first substrate is moved and/or is inclined or the first substrate is brought into contact with the reinforcing element. In an alternative method according to the invention, the reinforcing element is arranged on the second substrate, wherein this stack is then connected to the first substrate. The first substrate is subsequently heated and deformed such that a region of the first substrate is brought into contact with the reinforcing element.

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Meldorf, Germany

Vanessa Stenchly