Applied Materials, Inc.

Other

Van H Nguyen

Jeonghoon Oh

Roger M Johnson

Jamie Leighton

Manoj A Gajendra

Uday Pai

John Anthony Garcia

Laurent Strodiot

Manoj Balakumar

Christophe Debacq

Phillip Lovalenti

Laurence Plapied

Austin Wuerfel

Gagan Dobhal

Chetan Kumar Mylappanahalli Narasingaiah

Sanjay Bhanurao Chavan

A system and method for sequential single-sided CMP processing of opposite facing surfaces of a silicon carbide (SiC) substrate are disclosed. A method includes urging a first surface of a substrate against one of plurality of polishing pads, wherein the plurality of polishing pads are disposed on corresponding ones of a plurality of rotatable polishing platens. The method includes transferring, using the first side of the end effector, the substrate from the substrate carrier loading station to a substrate alignment station. The method includes transferring, using the first side of the end effector, the substrate from the substrate alignment station to a substrate carrier loading station. The method includes urging a second surface of the substrate against one of the plurality of polishing platens.

Substrate handling systems and methods for CMP processing

The present invention relates to thermostable quick-dissolving thin films comprising a biological moiety and an excipient mix which are suitable for the formulation of biological moieties such as viral vaccines, to methods for manufacturing such thermostable quick-dissolving thin films, and to their use in therapy. The excipient mix comprises one or more water-soluble polymer(s), a sugar selected from sucrose, trehalose and a combination thereof, a metal ion, a carboxylate, and a buffering agent.

Thermostable quick-dissolving thin film

Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.

Chemical mechanical polishing system with platen temperature control

An apparatus and method for sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing (CMP) systems is disclosed. A method includes transferring a first substrate to a first polishing station of a plurality of polishing stations, polishing the first substrate at the first polishing station, transferring the first substrate to a second polishing station, and transferring a second substrate to the first polishing station. The method includes cleaning a first surface of a plurality of surfaces of the polishing system by dispensing a first cleaning fluid from a first one or more nozzles of a plurality of nozzles to direct the first cleaning fluid onto the first surface and dispensing a second cleaning fluid from the first one or more nozzles to direct the second cleaning fluid onto the first surface, where the second cleaning fluid is different from the first cleaning fluid.

Sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing systems

Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body portion formed from a first material and a bottom projection extending below the body portion. The bottom projection has a bottom surface facing away from the body portion, and the bottom projection is formed form a second material different from the first material. The annular body includes a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces.

Edge load ring

A mobile fill station for filling propane cylinders by weight and volume. There can be up to three cabinets in the system wherein any one of the cabinets can have a beam scale with a hydraulic automatic stop device to stop filling automatically as the total weight of the cylinder reaches a pre-set scale limit. Any one of the cabinets can also include a flow meter to stop filling when an operator monitors an amount on the meter and manually stops propane flow. The cabinets could also include an electronic scale with a digital indicator where filling stops automatically as the total weight of the cylinder reaches a pre-set computer limit.

Apparatus for dispensing propane gas

Outdoor cooking stove

Growing community of inventors

Milpitas, CA, United States of America

Van H Nguyen