Xcerra Corporation

Delaware Capital Formation, Inc.

Wells-cti, Inc.

Valts Edgars Treibergs

Sergey Yakushev

Mark A Swart

Charles J Johnston

Jason Mroczkowski

Scott Chabineau

Edward A Kottmeyer

Mitchell Nelson

Michael S Glick

Aaron Magnuson

Travis Evans

Craig Joseph Reske

Jamie Black Doehrmann

Scott Hanson

William John Hayes

Kevin L Young

James Brandes

Dan Sikorski

A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.

Spring-loaded probe having folded portions and probe assembly

A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Test socket assembly and related methods

A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

Hybrid probe head assembly for testing a wafer device under test

A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus. The mount projections carry a small preload that ensures successful contact with the test equipment without the risk of damaging the test equipment with rigid contact surfaces.

Link socket sliding mount with preload

A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch.

Test probe assembly and related methods

A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a second plunger having a tail portion with a flat contact surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the sliding engagement of the flat surfaces increases during compression of the spring.

Spring contact assembly

A compliant electrical interconnect having a first component and a second component interlockingly engaged with the first component. Each component has two cantilever arms lockingly engaged and continuously biased against each other. Contact springs are captivated by the cantilever arms providing a contact force for the first and second components.

Electrical contact probe with compliant internal interconnect

An integrated printed circuit board and test contactor for high speed semiconductor testing having an alignment housing with a cavity for receipt and positioning of the integrated circuit to be tested, a printed circuit board having a non-conductive elastomer portion positioned along a surface of the printed circuit board and an electrically balanced microwave transmission line structure having flexible fingers for transmitting test signals from the integrated circuit through the printed circuit board. A U-shaped ground element extends around the microwave transmission line structure.

Integrated printed circuit board and test contactor for high speed semiconductor testing

An integrated circuit test socket is provided with contact holders which support torsion spring contacts in the socket. Each contact includes a length of wire which includes a wound portion with a pair of arms extending from opposite ends of the wound portion. One of the arms terminates in a portion engaging a corresponding terminal on an integrated circuit undergoing test, and the other arm includes a portion extending through a corresponding aperture in the socket to make electrical contact with a conductor of a circuit board.

Integrated circuit test socket having torsion wire contacts

A socket for positioning and installing an integrated circuit on a circuit board includes multiple contacts mounted in a base, each contacts receiving one of the leads which extend from the sides of the integrated circuit. The contacts include a pair of engagement members which are spread apart by spreader members which are forced between the engagement members by operation of an actuating member which is slidably mounted on the base, thereby permitting installation of the leads within the contacts. Upon release of the actuating member, the contact engagement members return to their initial position and engage on opposite sides of the leads, thus providing an electrical connection between the contacts and the leads. The contacts include offset lips on the upper end thereof which permits the engagement surfaces to deflect without interference with adjacent contacts. Contacts also include a contact arm which extends around the bottom wall of the socket and is clamped against the circuit board to provide electrical connections therewith.

Socket for positioning and installing an integrated circuit on a circuit

A socket for establishing a releasable connection between terminals of electronic modules and a circuit board includes a base having a module support surface for supporting the module in test position. A contact holder cooperates with the base for supporting contact elements for each terminal of the module. Each of the contact modules include a projecting portion projecting from the socket and before engagement with the circuit board, a support section which is supported on the contact holder in grooves defined between ribs and oriented with respect thereto by tabs on the contact elements engaging gaps in the grooves, and a deflecting section which extends over slots in the contact holder. When a module to be tested, the module is placed on the test surface and a lid pivotally mounted on the socket is closed to thereby push the terminals into engagement with the contact elements and thereafter downward force being accommodated by deflection of the deflectable portion of the contact elements into the grooves. A heat sink carried by the socket drains thermal energy from the module.

Test socket for electronic module

A test contactor for establishing a releasable connection between terminals of an integrated circuit electronic module to be tested and a circuit board connected to test equipment includes a housing carrying a contact element for each terminal of the module. Each contact element includes a contact surface which is engaged by the corresponding terminal of the modules when testing is effected. The contact surface is connected to a pad which connects the contact element to the circuit board by a spring arm that is slidably engaged with the pad. Accordingly, as the contact element is deflected during testing, the spring arm slides along the pad, and the resiliency of the contact element restores itself it is initial condition when the module is removed. The spring arm provides the shortest possible electrical path between the contact surface and the pad, thereby assuring a high frequency response.

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South Bend, IN, United States of America

Valts Edgars Treibergs