Juniper Networks, Inc.

Valery Kugel

Pradeep S Sindhu

Gunes Aybay

Theodore John Schmidt

Christian Malouin

Roberto Marcoccia

George R Sosnowski

Alexander I Yatskov

Peng Su

Bhavesh Patel

Stephen Cleeton

Muhammad Sagarwala

Jimmy Chun-Chuen Leung

Gautam Ganguly

John B Kenney

Christopher Otte

Aliaskar Hassanzadeh

Christopher J Otte

A disclosed apparatus may include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts that are disposed on the substrate and are electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for utilizing package stiffeners to attach cable assemblies to integrated circuits

The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

The stiffening brace may include a set of borders dimensioned to substantially surround an integrated circuit, wherein each border includes (1) a portion of material that is positioned atop a perimeter of the integrated circuit and (2) an additional portion of material that extends beyond the perimeter of the integrated circuit such that the additional portion of material overhangs a circuit board to which the integrated circuit is soldered. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for mitigating warpage of integrated circuits during reflow processes

A system may receive, by a switching component of the system, network traffic to be provided to an I/O component of the network device. The system may route, by the switching component, the network traffic to the I/O component based on whether the I/O component is connected to the switching component via the first connections and/or via second connections. The first connections may be connections via a chassis of the system. The second connections may be connections via a connector component that is removable from the switching component. The network traffic may be routed via the first connections and the second connections when the I/O component is connected via the first connections and the second connections. The network traffic may be routed via the first connections and not via the second connections when the I/O component is connected via the first connections and not via the second connections.

Supplemental connection fabric for chassis-based network device

In some examples, a device includes at least two integrated circuits (ICs) and a first multi-chip module (MCM) substrate coupled to the at least two ICs, the first MCM substrate comprising a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA. The device further includes a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, and wherein the second pitch is greater than the first pitch. The device further includes a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA, wherein the first MCM substrate and the second MCM substrate comprise organic, non-silicon insulating material.

Fan-out in ball grid array (BGA) package

An optical transmitter may generate a first optical signal having a first wavelength and a second optical signal having a second wavelength. The optical transmitter may output the first and second optical signals to a link without performing a multiplexing operation. The optical transmitter may output part of the first optical signal to the link while part of the second optical signal is being output to the link. An optical receiver may receive the first and second optical signals, via the link, as separate optical signals. The optical receiver may receive part of the first optical signal from the link while part of the second optical signal is being received from the link. The optical receiver may provide the first and second optical signals to a photodetector array that includes a first photodetector to detect the first optical signal and a second photodetector to detect the second optical signal.

Transmitter and receiver for direct communication of multiple optical wavelengths via an optical link

In some embodiments, an apparatus includes an optical transceiver system that includes a set of optical transmitters and a backup optical transmitter. In such embodiments, each optical transmitter from the set of optical transmitter can transmit at a unique wavelength from a set of wavelengths. The backup optical transmitter can transmit at a wavelength from the set of wavelengths when an optical transmitter from the set of optical transmitters associated with that wavelength fails. In other embodiments, an apparatus includes an optical transceiver system that includes a set of optical receivers and a backup optical receiver. The backup optical receiver can receive at a wavelength from the set of wavelengths when an optical receiver from the set of optical receivers associated with that wavelength fails.

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Sunnyvale, CA, United States of America

Valery Kugel