Diamond Innovations. Inc.

Valeriy Konovalov

Abhijit Prabhakar Suryavanshi

Andrew Gledhill

Christopher Long

Polycrystalline diamond cutters for rotary drill bits and methods of making the same are disclosed. Polycrystalline diamond cutters include a support substrate and a polycrystalline diamond body coupled to the support substrate. The polycrystalline diamond body includes a plurality of diamond grains exhibiting inter-diamond bonding therebetween and defining a plurality of interstitial regions, a non-catalytic material distributed throughout the polycrystalline diamond body in a detectable amount, and a catalytic material distributed throughout the polycrystalline diamond body in a detectable amount.

Polycrystalline diamond cutters having non-catalytic material addition and methods of making the same

A superabrasive cutter and a method of making the superabrasive cutter are disclosed. The superabrasive cutter may comprise a plurality of polycrystalline superabrasive particles and about 0.01% to about 4% by weight of the superabrasive particles of a dopant as evaluated prior to a high pressure/high temperature process. The dopant may be immiscible with a catalyst for forming the polycrystalline superabrasive particles.

PDC cutter with chemical addition for enhanced abrasion resistance

A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may include a plurality of polycrystalline superabrasive particles made of surface functionalized superabrasive particles. The surface functionalized superabrasive particles may have halogens or organic moiety instead of hydrogen.

Polycrystalline diamond compact fabricated from surface functionalized diamond particles

A superabrasive compact and a method of making the superabrasive compact are disclosed. A method of making a superabrasive compact may comprise steps of treating a substrate to remove a first binder material from a portion of the substrate; introducing a first material into the portion of the substrate, forming a first modified substrate; and treating the porting of modified substrate to remove at least a part of the first material to form a second modified substrate.

Growing community of inventors

Lewis Center, OH, United States of America

Valeriy Konovalov