Kateeva, Inc.

Massachusetts Institute of Technology

Valerie Gassend

Eliyahu Vronsky

Alexander Sou-Kang Ko

Conor Francis Madigan

Nahid Harjee

Lucas David Barkley

Christopher R Hauf

Gregory Lewis

Dariusz Golda

Hyeun-Su Kim

Vladimir Bulovic

Marc A Baldo

Martin Arnold Schmidt

Jianglong Chen

An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different printhead/substrate scan offsets, offsets between printheads, the use of different nozzle drive waveforms, and/or other techniques. These combinations can be based on repeated, rapid droplet measurements that develop understandings for each nozzle of means and spreads for expected droplet volume, velocity and trajectory, with combinations of droplets being planned based on these statistical parameters. Optionally, random fill variation can be introduced so as to mitigate Mura effects in a finished display device. The disclosed techniques have many possible applications.

Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances

In one embodiment the disclosure relates to an apparatus for depositing an organic material on a substrate, including a source heater for heating organic particles to form suspended organic particles; a transport stream for delivering the suspended organic particles to a discharge nozzle, the discharge nozzle having a plurality of micro-pores, the micro-pores providing a conduit for passage of the suspended organic particles; and a nozzle heater for pulsatingly heating the micro-pores nozzle to discharge the suspended organic particles from the discharge nozzle.

Method and apparatus for depositing LED organic film

The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

Modular printhead for OLED printing

The disclosure relates to a method for depositing an organic film layer on a substrate. In one implementation a method to deposit organic film by generating vaporized organic particles; streaming a carrier fluid proximal to a source to carry the vaporized organic particles and solid organic particles from the source towards the substrate; transporting the vaporized and solid organic particles through a discharge nozzle with a plurality of micro-pore openings, placed between the source and the substrate, that permits the passage of at least a portion of the vaporized or solid organic particles through the micro-pores; depositing the vaporized organic particles and the solid organic particles that are transported through the discharge nozzle onto the substrate.

A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

Low-profile MEMS thermal printhead die having backside electrical connections

Growing community of inventors

San Carlos, CA, United States of America

Valerie Gassend