Kulicke & Soffa Netherlands B.v.

Uniqarta, Inc.

Kulicke and Soffa Industries, Inc.

Ndsu-research Foundation

Val Marinov

Matthew R Semler

Ronn Kliger

Yuriy Atanasov

Zhigang Chen

Mark Pavicic

Samuel Brown

Orven Swenson

Ferdous Sarwar

Ross A Miller

A method of transferring a die from a carrier to a receive substrate is provided. The method includes the steps of: (a) supporting a die on a carrier, a transfer material being provided between the die and the carrier; (b) exposing the transfer material to light energy to form a bubble in the transfer material; and (c) transferring the die from the carrier to a receive substrate using the bubble, the die being in contact with the bubble when the die contacts the receive substrate.

Methods of transferring a die from a carrier to a receive substrate, and related systems and materials

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Setting up ultra-small or ultra-thin discrete components for easy assembly

A system includes a vacuum chuck; and a tape. The tape includes a flexible polymer substrate; and an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate. The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate.

Adhesive tapes for receiving discrete components

A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

Dynamic release tapes for assembly of discrete components

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Parallel assembly of discrete components onto a substrate

An apparatus includes a first substrate including one or more electrical connection features; and an assembly including: a second substrate; conductive features formed on the second substrate, one or more of which are electrically connected to corresponding electrical connection features of the first substrate; and an electronic component between the second substrate and the first substrate and electrically connected to one or more of the conductive features.

Connecting electronic components to substrates

Methods for releasing ultra-small or ultra-thin discrete components from a substrate

A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.

Placing ultra-small or ultra-thin discrete components

Among other things, a sheet has a thickness and extends in two dimensions normal to the thickness of the sheet. Within the sheet there is an electronic device having an integrated circuit and conductive elements connected to the integrated circuit. The electronic device extends in the two dimensions, the extent of the device in each of the two dimensions being greater than 3 mm.

Electronic device incorporated into a sheet

Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Growing community of inventors

Fargo, ND, United States of America

Val Marinov