Ingersoll-rand Industrial U.s., Inc.

Vairavasundaram Swaminathan

Scott Turner

William Durham

Joshua Odell Johnson

Jefferey Clifford Yaschur

Dennis Naksen

Justin T Chellew

A power tool comprises an adjustable auxiliary handle assembly that facilities safe use of the tool by the operator while allowing convenient carry and storage of the tool when not in use. The adjustable auxiliary handle assembly comprises an indexing mechanism that includes an angled connector, a slidable latching mechanism and a handle base. The indexing mechanism allows a longitudinal handle to rotate and be locked in a position convenient and comfortable to the operator. The indexing mechanism is adjustable and can be operated with one hand (e.g., one-handed operation). The latching mechanism holds the auxiliary handle position in place while allowing the power tool to be used in high-torque/high load applications.

Quick change auxiliary handle for power tool

A cooling assembly for a power tool includes an air mover configured to be disposed within a housing assembly at a first end of a generally longitudinal enclosure proximate to a handle enclosure. The air mover is configured to direct air into the housing assembly and then generally perpendicularly to a longitudinally extending direction of the generally longitudinal enclosure. The cooling assembly also includes a duct configured to connect to the air mover and be in fluid communication with the air mover to direct air into the handle enclosure. The duct includes an inflow segment defining a first area for receiving the air from the air mover, an outflow segment defining a second area for directing the air from the air mover into the handle enclosure, and a connecting segment connecting the inflow segment to the outflow segment.

Power tool with fan duct for printed circuit board

The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.

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Bengaluru, India

Vairavasundaram Swaminathan