Microsoft Technology Licensing, LLC

Vaidehi Oruganti

Husam Atallah Alissa

Bharath Ramakrishnan

Christian L Belady

Mark Alan Monroe

Eric Clarence Peterson

Sean Michael James

Nicholas Andrew Keehn

Ioannis Manousakis

Ruslan Nagimov

Martha Geoghegan Peterson

A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.

Systems and methods for thermal management of electronic devices

A carbon capture system includes two carbon capture plates. A first carbon capture plate collects carbon dioxide from a flow of ambient air. A second carbon capture plate releases carbon dioxide upon application of heat from a heat exchanger. The heat is exhaust heat from a data center. The first carbon capture plate and the second carbon capture plate are rotatable between the capture and release positions. The carbon capture system uses the waste heat from a data center to collect and store atmospheric carbon dioxide, thereby reducing the concentration of atmospheric carbon dioxide.

Carbon capture system

An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.

Liquid powered and cooled microfluidics photonics architecture

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Ultra dense processors with embedded microfluidic cooling

Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.

Pressure based phase immersion cooling system

A thermal management system includes a server computer and a shell defining an immersion chamber. The shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side. The shell is connected to the server computer and a portion of the server computer defines at least a portion of the immersion chamber.

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Kirkland, WA, United States of America

Vaidehi Oruganti