Other

Apple Inc.

Vaibhav D Patel

Xia Li

Imran Hashim

Kapil Vinod Sakariya

Hsin-Hua Hu

Tore Nauta

Andreas Bibl

John A Higginson

Thomas Charisoulis

Edzer Huitema

Ralph E Kauffman

Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.

Stacked hybrid micro LED pixel architecture

Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

Display with embedded pixel driver chips

Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.

Backplane LED integration and functionalization structures

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San Jose, CA, United States of America

Vaibhav D Patel