Intel Corporation

Vaibhav Agrawal

Omkar G Karhade

Digvijay Ashokkumar Raorane

Mitul Bharat Modi

Edvin Cetegen

Dingying David Xu

Nicholas S Haehn

Yiqun Bai

Ziyin Lin

Joseph Van Nausdle

Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled to a surface thereof. A dummy die, adjacent to an IC die and coupled to a region of the substrate, comprises a polymer resin and a filler. A package mold structure of the packaged device adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate. In another embodiment, a first CTE of the dummy die is less than a second CTE of the package mold structure, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the package mold structure.

Dummy die structures of a packaged integrated circuit device

Growing community of inventors

Chandler, AZ, United States of America

Vaibhav Agrawal