Bridgelux Incorporated

Toshiba Techno Center Inc.

Wj Semiconductor Equipment Group, Inc.

Vahid S Moshtagh

Robert Tudhope

Hannu Tapani Hukkanen

Alexander Rizkin

Tomi Mikael Kuntze

Jeffrey C Ramer

Alexander Shaikevitch

Heng Liu

Jeffery Ramer

Michael Solomensky

A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array.

Highly efficient LED array module with pre-calculated non-circular asymmetrical light distribution

A system for flash-free over-molding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.

System for flash-free over-molding of LED array substrates

An LED light source with an attached heat sink includes larger fins, smaller fins, a mounting platform and light emitting diodes attached to the mounting platform. The larger fins are oriented parallel to the smaller fins. The larger fins are integrally formed with a first base, and the smaller fins are integrally formed with a second base. The bottom surface of the second base contacts the larger fins, which are more than twice as tall as the smaller fins. There are more than twice as many smaller fins than larger fins per distance perpendicular to the fins. Ducts are formed between the larger fins and the bottom surface of the second base. Intake holes pass through the first base into each duct near the end of the duct that is blocked by an end wall. The mounting platform with the LEDs is attached to the bottom of the first base.

Low profile heat sink with attached LED light source

A shower head for a chemical vapor deposition chamber can have a housing, a plurality of bosses formed upon the housing, and an inside cover. The bosses can have bores formed therethrough. The inside cover can be attached to the bosses and can have apertures formed therein such that the apertures are generally contiguous with the bores. The housing, the bosses, and the inside cover cooperate to communicate water through the shower head. The water can cool the shower head to a temperature that is substantially lower than the temperature of other parts of the chemical vapor deposition chamber, e.g., the susceptor thereof.

Machine CVD shower head

System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.

System for flash-free overmolding of led array substrates

A cross flow chemical vapor deposition chamber can comprise an inlet duct having a generally rectangular cross-section and an outlet duct having a generally rectangular cross-section. The rectangular inlet duct and the rectangular outlet duct can facilitate laminar flow of reactant gases over a susceptor. Movable partitions can be configured to define a plurality of zones within the chamber. Each zone can contain a different reactant gas, concentration of reactant gas, and/or flow rate of reactant gas. Enhanced laminar flow can be provided, undesirable depletion of reactant gas can be mitigated, and enhanced control of reactant gases can be facilitated.

Cross flow CVD reactor

A shower head for a chemical vapor deposition chamber can comprise a plurality of first injectors for a first reactant gas and a plurality of second injectors for a second reactant gas. The first and second injectors can be interspersed among one another so as to enhance control of the mixing and delivery of reactant gases within the chemical deposition chamber. Cooling water can be communicated through a plurality of gun drilled bores formed intermediate injectors of the shower head. In this manner, enhanced control of the mixing and delivery of reactant gases can be provided.

Drilled CVD shower head

A conforming heat dissipating structure transfers heat to an irregular surface from a heat source mounted on its bottom surface. The heat dissipating structure includes an open container filled with metal shavings and balls covered by a flexible retainer. The shavings and balls beneath the flexible retainer are pressed against the irregular surface and conform to its irregular shape. In one application, light emitting diodes are mounted to the bottom of the heat dissipating structure, and the shavings are compressed against the inside cover of a street light. A flexible heat rod enables heat to be transferred over a flexible path from a heat source on one heat dissipating structure to a heat sink pressed against another heat dissipating structure. The many strands that make up the flexible heat rod are spread out inside each open container and are pressed between the metallic shavings to achieve a good thermal contact.

Shape forming heat sink with flexible heat rod

A rotational support assembly for holding and rotating an article. The assembly includes a support member for holding the article and a drive mechanism for rotating the support member. A drive shaft couples the drive mechanism directly to the support member. The assembly also includes a vacuum system including at least one passageway formed in the support member and the drive shaft. The passageway extends between an inlet in the shaft for coupling the passageway to a vacuum source and an outlet opening connected to the surface of the support member for holding the article against the support member by a vacuum.

Growing community of inventors

San Jose, CA, United States of America

Vahid S Moshtagh