Motorola Corporation

Motorola Mobility LLC

Google Inc.

Vahid Goudarzi

Gulten Goudarzi

Julio A Abdala

Fan He

Michael W Frenzer

Shumin Cheng

Juli A Abdala

Bin Jiang

A Through Mold Via (TMV) Integrated Circuit (IC) package is provided as a bottom IC package for a TMV Package on Package (POP) configuration. The TMV IC package has an overmold top portion having a substantially flat surface and spacer or standoff features extending upward from the flat surface. The spacer or standoff features are configured to abut the bottom surface of the top POP package during softer reflow in order to maintain a gap of predetermined height between the top and bottom IC packages.

Method to enhance reliability of through mold via TMVA part on part POP devices

A module () can include a first substrate () comprised of a first material, at least a second substrate () comprised of at least a second material, selectively applied solder () of a first composition residing between the first substrate and at least the second substrate, and selectively applied solder () of at least a second composition residing between the first substrate and at least the second substrate. Preferably, no crack will exist in the module as a result of a reflow process of the solder due to the CTE mismatch between the first and second substrates. The different selectively applied solder compositions can have different melting points and can be solder balls, solder paste, solder preform or any other known form of solder.

Method and arrangement for reduced thermal stress between substrates

A substrate () has a region of conductor segments () and a matrix display driver () mounted on it. The matrix display driver is used for creating pixilated images or symbols, while the conductor segments are used for turning on or off iconic elements. An encapsulated electrophoretic display laminate () is mounted over both the matrix display driver and the region of conductor segments to form the mixed mode display.

Mixed-mode encapsulated electrophoretic display for electronic device

A system () and method () for determining whether a sample object () has a color that is within a predetermined range is provided. The system () includes a light source () capable of projecting lights having different light wavelength spectrum upon the sample object (). A controller () causes the light source () to project a first light wavelength spectrum upon the sample object (), then another, then another, and so forth. While each light is projecting upon the object, a monochromatic image capture device () captures an image having luminous intensity information. The luminous intensity information, or a subset thereof selected by an image selection tool () is then compared to the statistical range, which is derived from a plurality of images taken of a reference object ().

Spectrum verification imaging system and method

A method () of reducing stress between substrates of differing materials includes the steps of applying () solder () on a first substrate (), reflowing () the solder on the first substrate to form a cladded substrate (), applying () a medium such as flux or solder on a second substrate () having a substantially different coefficient of thermal expansion than the first substrate, placing () the cladded substrate on the second substrate, and reflowing () the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.

Method for reducing stress between substrates of differing materials

A populated printed wiring board (PWB) () and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB () with exposed copper pads (), coating the copper pads with an organic solderability preservative (OSP) (), depositing a solder paste that includes lead-free solder on the OSP covered copper pads (), placing components () and heating the PWB above a liquidous temperature of the lead-free solder in an air atmosphere (). The process allows very close spacing of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non-negligible planarity or coplanarity tolerances.

Populated printed wiring board and method of manufacture

A method () of attaching a shield (or) to a substrate () can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (), applying () solder to the metallized trace pattern, and optionally placing () components (and) on portions of the metallized trace pattern. The method can further include the steps of reflowing () the solder to form a selective cladded trace pattern (or) on a portion of the metallized trace pattern reserved for the shield, placing () the shield on the cladded trace pattern, and reflowing () the substrate.

Growing community of inventors

Coral Springs, FL, United States of America

Vahid Goudarzi