Silanna Asia Pte Ltd

Peregrine Semiconductor Corporation

Vadim Kushner

Nima Beikae

Shanghui Larry Tu

Erica Poole

Eric Vann

A thyristor tile includes first and second PNP tiles and first and second NPN tiles. Each PNP tile is adjacent to both NPN tiles, and each NPN tile is adjacent to both PNP tiles. A thyristor includes a plurality of PNP tiles and a plurality of NPN tiles. The PNP and NPN tiles are arranged in an alternating configuration in both rows and columns. The PNP tiles are oriented perpendicular to the NPN tiles. Interconnect layers have a geometry that enables even distribution of signals to the PNP and NPN tiles.

Tiled lateral thyristor

A lateral transistor tile is formed with first and second collector regions that longitudinally span first and second sides of the transistor tile; and a base region and an emitter region that are between the first and second collector regions and are both centered on a longitudinal midline of the transistor tile. A base-collector current, a collector-emitter current, and a base-emitter current flow horizontally; and the direction of the base-emitter current is perpendicular to the direction of the base-collector current and the collector-emitter current. Lateral BJT transistors having a variety of layouts are formed from a plurality of the tiles and share common components thereof.

Tiled lateral BJT

A semiconductor device includes an active region formed over a substrate. The active region includes a FET and a diode. The FET includes one or more FET fingers. Each FET finger includes a FET source region, a FET drain region, and a lateral FET gate electrode. The diode includes one or more diode fingers. Each of the diode fingers includes a diode anode region electrically coupled to the FET source region, a diode cathode region electrically coupled to the FET drain region, and a lateral diode gate electrode electrically coupled to the diode anode region and electrically isolated from the lateral FET gate electrode. The FET fingers are active fingers of the semiconductor device and the diode fingers are dummy fingers of the semiconductor device. The diode is configured to clamp a maximum voltage developed across the FET drain region and the FET source region.

Avalanche robust LDMOS

Systems, methods, and apparatus for ESD protection with adjustable trigger voltage decoupled from DC breakdown voltage for semiconductor devices including field effect transistors (FETs), and particularly to metal-oxide-semiconductors (MOSFETs) fabricated on silicon-on-insulator ('SOI') and silicon-on-sapphire ('SOS') substrates are described. The apparatus and method are configured to change reverse biased drain junctions which in turn can control the DC breakdown voltage and the trigger voltage.

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Solana Beach, CA, United States of America

Vadim Kushner