Sun Microsystems, Inc.

Future Wei Technologies, Inc.

Oracle America, Inc.

Other

Oracle International Corporation

Vadim Gektin

Deviprasad Malladi

David W Copeland

Mo Bai

James A Jones

Jiye Xu

Youlin Jin

Ali Heydari

Anwar Mohammed

Bidyut Kanti Sen

Shlomo D Novotny

Marlin R Vogel

Seshasayee S Ankireddi

Chengpeng Yang

Xing Fu

Scott Lee Kirkman

Margaret B Stern

Quanming Li

Guo Yang

Seshasayee Ankireddi

A device includes a charger case. Charging electronics are supported within the case. An electrical connector is coupled to the charging electronics for coupling to a power source. A cooling element is coupled to the charger case and extendable to an extended position from the case such that a cooling surface area of the charger case is increased.

Charger having retractable cooling surface

A fluid coupling mating apparatus and method. Included is at least one mating member for removably coupling with another mating member for allowing fluid to pass therebetween. A lock is movably coupled to the at least one mating member. Still yet, a holder is coupled to the lock for holding the lock in relation to the holder during at least a portion of the removable coupling of the at least one mating member with another mating member.

Fluid coupling mating apparatus and method

The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.

Stationary cooling structure for board/chassis-level conduction cooling

An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.

Optical communication component cooling

A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.

Heat spreader with thermally coductive foam core

The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling air is circulated to the line cards. One technique for centrally locating the LC-to-CP interfaces on the connection plane is to invert one column of line cards. Another technique for centrally locating the LC-to-CP interfaces on the connection plane is to use non-uniform line cards. An additional benefit of centrally locating the LC-to-CP interfaces on the connection plane is that the inter-LC channels extending between perpendicularly adjacent line cards are shortened, which increases server performance by virtue of reducing switching latency.

Centralized chassis architecture for half-width boards

Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.

Apparatus and method for a back plate for heat sink mounting

Lower semiconductor dies in 2.5 D semiconductor packaging configurations can be cooled by thermally coupling the lower semiconductor dies to a heat sink positioned above the interposer, to an upper semiconductor die, to a heat sink affixed beneath a substrate, or to free-flowing air circulating above the interposer or beneath the substrate. The thermal coupling can be achieved using heat pipes, thermal vias, or other conductive passage ways.

Thermal management in 2.5 D semiconductor packaging

A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

Chassis with adjustable baffle for cooling

A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.

Metallic thermal joint for high power density chips

A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

Thermal and power bus stacked package architecture

A multi-surface compliant heat removal process that includes identifying components to share a heat rejecting device; applying non-adhesive film to the components; identifying a primary component of the components; and applying phase change material on each of the components, other than the primary component. The phase change material is placed on top of the non-adhesive film. The process also includes placing the heat rejecting device on the corresponding components and removing the heat rejecting device from the corresponding components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the components; and placing the heat rejecting device on the corresponding components.

Optimized lid attach process for thermal management and multi-surface compliant heat removal

In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.

Carbon nanotube based interposer

A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device, applying non-adhesive film to the one or more components, identifying a primary component of the one or more components, and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device, removing the non-adhesive film from the heat rejecting device, placing a heatsink-attach thermal interface material on the one or more components, and placing the heat rejecting device on the corresponding one or more components.

A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

Growing community of inventors

San Jose, CA, United States of America

Vadim Gektin