Alpha Assembly Solutions Inc.

V Sathish Kumar

Bawa Singh

Siuli Sarkar

Ranjit Pandher

Sutapa Mukherjee

Ravindra Mohan Bhatkal

Remya Chandran

Shamik Ghoshal

Pavan Vishwanath

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

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Bengaluru, India

V Sathish Kumar