Infineon Technologies Ag

Infineon Technologies Austria Ag

Uwe Schindler

Horst Theuss

Jochen Dangelmaier

Martin Petz

Frank Singer

Klaus Elian

Martin Gruber

Andreas Grassmann

Adolf Koller

Mathias Vaupel

Stefan Paulus

Albert Auburger

Rudolf Lehner

Cyrus Ghahremani

Alfred Gottlieb

Marcus Boehm

A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

GMR sensor within molded magnetic material employing non-magnetic spacer

A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The die further includes a second side opposite the first side, a lateral edge extending between the first and second sides and a terminal at the first side. An electrical conductor connects the terminal to the lead. An encapsulant is disposed along the lateral edge of the die so that the terminal and the electrical conductor are spaced apart from the encapsulant. The encapsulant has an elastic modulus of less 10 MPa at room temperature. A molding compound covers and contacts the lead, the electrical conductor, the encapsulant, the terminal and part of the first side of the die so that the diaphragm is uncovered by the molding compound.

Die edge protection for pressure sensor packages

A connector module () has a base body () having a first contact () for electrically contacting an optoelectronic module () to be positioned into a depression () in the base body, a second contact () for electronically contacting a board, and a conductive trace () for electrically connecting the first () and second () contacts on a surface of the base body (), and a molded part (), the molded part () being cast onto the base body () across a first part of the surface, and the base body () and/or the molded part () defining a through-opening () for introducing a fiber (). The base body () and the molded part () form two jaws for gripping the fiber ().

Connector module and method of manufacturing the same

A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Integrated magnetic sensor component

Growing community of inventors

Reichenbach, Germany

Uwe Schindler