Steag Micro Tech Gmbh

Mattson Wet Products

Uwe M&uuml;ller

Robert Pesce

Robert Boos

John Oshinowo

Manfred Schenkl

In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned to respective reservoir and the collection vessel is rinsed before receiving another treatment fluid.

Device and method for the treatment of semiconductor wafers

An apparatus for discharging a liquid from a container is provided. A mobile unit is disposed in the container in such a way as to be movable therein in a contact-free manner for reducing the volume of the container. A bellows connects the mobile unit in a liquid-tight manner to an inner wall of the container. An interior chamber of the bellows that faces away from the container, together with a housing, form a space that is closed off against the exterior. A spindle, as a drive apparatus, is disposed in this space. The spindle is connected to the mobile unit in the interior chamber of the bellows.

Growing community of inventors

Dresden, Germany

Uwe Müller

Growing community of inventors

Dresden, Germany

Uwe M&uuml;ller

Uwe Müller