Leybold Aktiengesellschaft

Degussa Aktiengesellschaft

Uwe Kopacz

Christoph Daube

Bernd Hensel

Martin Weigert

Dieter Hofmann

Uwe Konietzka

Hans Schussler

Andreas Rack

Alfred Belz

Siegfried Schulz

Horst Becker

Gunter Eckhardt

The invention concerns a process for coating a substrate 1 of little or no corrosion resistance, especially a metal substrate having an alloy consisting at least of Ni, Cr and Fe, in an evacuable coating chamber 15, 15a. It comprises making an electrode that can be connected to a current supply 10, this electrode being electrically connected to a target 3 which is sputtered and the sputtered particles of which are deposited on the substrate 1. Reactive process gases are, for this purpose, supplied to the coating chamber 15, 15a, so that an amorphously depositing layer 2 is applied onto the substrate.

Method for coating a substrate of low resistance to corrosion

An apparatus for determining the concentration of a gas in a vacuum chamber is described. Internal to the vacuum chamber are one or more cathodes. The chamber is fed via a gas inlet and is connected to a separate measurement chamber for accommodating a measuring device via a connecting line between the two chambers. The connecting line in conjunction with a pumping means produces a pressure gradient between the interior of the vacuum chamber and the interior of the measurement chamber. One end of the connecting line, located within the vacuum chamber terminates directly in the central region of a cathode surfaces facing the interior of the chamber, and the length, as well as the cross section of the connecting line being dimensioned so that the pressure gradient between the interior of the vacuum chamber and the interior of the measurement chamber, is precisely that required for measurement.

Apparatus for determining the concentration of a gas in a vacuum chamber

Coating of components and shapes by cathode sputtering of target material of a first cathode system (6) with concentration of a first discharge space (plasma cloud) in the vicinity of the target surface by a spatially closed magnetic field (plasma trap) opposite the target (12). The field strength is reduced in front of the target surface by an additional magnet associated with a lateral boundary of the target.

Method for coating components or shapes by cathode sputtering

A device for coating substrates has a rectangular magnetron cathode 2 with a target, a substrate holder 16 that can be rotated around a rotating axis 17 which is parallel to the longitudinal edges of the target, a planar wall 20 made of a non-magnetic material and having longitudinal edges 21, 22 also parallel to the rotating axis 17. Behind the wall there is a magnet arrangement and the magnetron cathode 2 and the wall 20 are disposed on opposite sides of the rotating axis. The device further includes a planar anode. In order to intensify and the effect of the plasma and render it more uniform, the distance on the substrate path between the longitudinal edges 12, 13 of the target and the longitudinal edges 21, 22 of the wall parallel thereto is reduced by at least one additional wall 25, 26 with a magnet arrangement 27, 28 disposed therebehind. Further, the poles of all the magnet arrangements 23, 27, 28 alternate on the circumference of the substrate holder 16 such that the entire circumference of the substrate holder is surrounded by an uninterrupted series of magnetic tunnels.

Apparatus for coating three dimensional substrates by means of cathode

Growing community of inventors

Hainburg, Germany

Uwe Kopacz