Applied Materials Gmbh & Co Kg

Applied Materials, Inc.

Fap Forschungs- Und Applikationslabor Plasmatechnik Gmbh

Uwe Hoffmann

Dieter Haas

Stefan Bangert

Jose Manuel Dieguez-Campo

Thomas Gebele

Jutta Trube

Marcus Bender

Frank Stahr

Klaus Schade

Marcel Martini

Juergen Bruch

Elisabeth Sommer

Manuel Dieguez-Campo

Manfred Schreil

Jürgen Bruch

José Manuel Dieguez-Campo

The present invention refers to a method as well as an apparatus for depositing a layer at a substrate, the layer containing at least two components co-deposited by at least two evaporation sources, wherein the mixture of the components regarding the content of the components is set by tilting the evaporation sources to predetermined angle and/or by positioning the evaporation sources at a predetermined distance with respect to the substrate and/or wherein evaporation plumes of the evaporation sources are arranged such that the maxima of the evaporation plumes are separated locally with respect to the substrate.

Method and apparatus for depositing mixed layers

A process of coating at least one substrate with a plurality of deposition sources, a method of tooling, a carrier unit and a deposition system are described. The systems and methods provide for or allow for exposing a first substrate portionof said at least one substrateto a first deposition sourcethrough an apertureof a carrier unit, depositing a first layerover the first substrate portion, said first layer including material from said first deposition source, varying a relative position between said at least one substrate and said aperture for exposing a second substrate portion of said at least one substrate, or another substrate, to a second deposition source, and depositing a second layerover the second substrate portion, said second layer including material from said second deposition source.

Tooling carrier for inline coating machine, method of operating thereof and process of coating a substrate

The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.

Arrangement for coating a substrate

An apparatus for coating an areal substrate, for example a rectangular plate comprises a vaporizer source and a distributor system for the supply of vaporized material onto the substrate. The distributor system comprises a line source, with this line source and the substrate is movable relative to one another. The apparatus serves preferably for the production of flat screens with organic light-emitting diodes.

Apparatus and method for coating an areal substrate

A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, where the method includes the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 &#x3bc;m/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently.

Method of cleaning a patterning device, method of depositing a layer system on a substrate, system for cleaning a patterning device, and coating system for depositing a layer system on a substrate

The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (), which is directly arranged on the device or the surface to be encapsulated; a planarization layer () arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer () arranged on the planarization layer.

Encapsulation for organic device

Growing community of inventors

Alzenau, Germany

Uwe Hoffmann