Infineon Technologies Ag

Intel Corporation

Intel Mobile Communications Gmbh

Uwe Hodel

Peter Baumgartner

Domagoj Siprak

Stephan Leuschner

Richard Geiger

Harald Gossner

Marko Radosavljevic

Han Wui Then

Sansaptak W Dasgupta

Wolfgang Soldner

Wolfgang Molzer

Andreas Martin

Wolfgang Heinrigs

Giovanni Calabrese

Wolfgang Werner

Marc Tiebout

Jan-Erik Mueller

Philipp Riess

Martin Streibl

Snezana Jenei

Martin Stiftinger

Thomas Benetik

Walther Lutz

Georgios Panagopoulos

Christoph Kienmayer

Luis Giles

Johannes Xaver Rauh

Richard Hudeczek

Andreas Lachmann

Alexander Bechtold

Roshini Sachithanandan

Vase Jovanov

Gregor Bracher

Karl-Henrik Ryden

Carla Moran Guizan

IC devices including transmission lines are disclosed. An example IC device includes two electrically conductive layers (first and second layers) and a support structure between the two electrically conductive layers. The first layer is coupled to transistors over or at least partially in the support structure. A shield of a transmission is placed in the first layer. Conductors of the transmission line are placed in the second layer and are coupled to the first layer by TSVs. Another example IC device includes three electrically conductive layers (first, second, and third layers). The first layer is coupled to transistors over or at least partially in the support structure. A shield of a transmission line is placed in the second layer and conductors of the transmission line are placed in the third layer. The conductors are coupled to the first layer by TSVs and coupled to the second layer by vias.

Integrated circuit device comprising tunable transmission line using buried power rail technology

A variable capacitance III-N device having multiple two-dimensional electron gas (2DEG) layers are described. In some embodiments, the device comprises a first source and a first drain; a first polarization layer adjacent to the first source and the first drain; a first channel layer coupled to the first source and the first drain and adjacent to the first polarization layer, the first channel layer comprising a first 2DEG region; a second source and a second drain; a second polarization layer adjacent to the second source and the second drain; and a second channel layer coupled to the second source and the second drain and adjacent to the second polarization layer, the second channel layer comprising a second 2DEG region, wherein the second channel layer is over the first polarization layer.

Variable capacitance device with multiple two-dimensional electron gas (2DEG) layers

A Group III-Nitride (III-N) device structure is provided which comprises: a heterostructure having three or more layers comprising III-N material, an anode within a recess that extends through two or more of the layers, wherein the anode is in electrical contact with the first layer, a cathode comprising donor dopants, wherein the cathode is on the first layer of the heterostructure; and a conducting region in the first layer in direct contact to the cathode and conductively connected to the anode. Other embodiments are also disclosed and claimed.

Group III-nitride Schottky diode

A Group III-Nitride (III-N) device structure is provided comprising: a heterostructure having three or more layers comprising III-N material, an anode n+ region and a cathode comprising donor dopants, wherein the anode n+ region and the cathode are on the first layer of the heterostructure and wherein the anode n+ region and the cathode extend beyond the heterostructure, and an anode metal region within a recess that extends through two or more of the layers, wherein the anode metal region is in electrical contact with the first layer, wherein the anode metal region comprises a first width within the recess and a second width beyond the recess, and wherein the anode metal region is coupled with the anode n+ region. Other embodiments are also disclosed and claimed.

Group III-nitride silicon controlled rectifier

A Group III-Nitride (III-N) device structure is presented comprising: a heterostructure having three or more layers comprising III-N material, a cathode comprising donor dopants, wherein the cathode is on a first layer of the heterostructure, an anode within a recess that extends through two or more of the layers of the heterostructure, wherein the anode comprises a first region wherein the anode is separated from the heterostructure by a high k dielectric material, and a second region wherein the anode is in direct contact with the heterostructure, and a conducting region in the first layer in direct contact to the cathode and conductively connected to the anode. Other embodiments are also disclosed and claimed.

Group III-nitride antenna diode

A semiconductor device is proposed. The semiconductor device includes a source region of a field effect transistor having a first conductivity type, a body region of the field effect transistor having a second conductivity type, and a drain region of the field effect transistor having the first conductivity type. The source region, the drain region, and the body region are located in a semiconductor substrate of the semiconductor device and the body region is located between the source region and the drain region. The drain region extends from the body region through a buried portion of the drain region to a drain contact portion of the drain region located at a surface of the semiconductor substrate, the buried portion of the drain region is located beneath a spacer doping region, and the spacer doping region is located within the semiconductor substrate.

Semiconductor devices and methods for forming semiconductor devices

Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes an array having at least one first region and at least one second region. The at least one first region includes at least one first device oriented in a first direction. The at least one second region includes at least one second device oriented in a second direction. The second direction is different than the first direction.

Methods of manufacturing semiconductor devices

Disclosed herein are Lateral Diffused Metal Oxide Semiconductor (LDMOS) device and trench isolation related devices, methods, and techniques. In one illustration, a doped region is formed within a semiconductor substrate. A trench isolation region is formed within the doped region. The doped region and the trench isolation region are part of a Lateral Diffused Metal Oxide Semiconductor (LDMOS) device. The trench isolation region or an interface between the trench isolation region and the doped region is configured to reduce low frequency noise in the LDMOS device.

Methods of forming low noise semiconductor devices

Semiconductor devices may be configured to reduce noise in the devices. For example, a semiconductor device may be configured or made with a first doped region within a semiconductor substrate to operate as an extended drain region, a trench isolation region, a second doped region between the first doped region and the trench isolation region, wherein the trench isolation region and the second doped region may be at least partially formed within the first doped region. Additionally, or alternatively, the second doped region may be within the first doped region and at least partially surround the trench isolation region, the first and second doped regions may have the same conductivity type, and the second doped region may have a higher conductivity than the first doped region.

Low noise semiconductor devices

Semiconductor devices having transistors along different orientations

In accordance with one exemplary embodiment, an electronic circuit is provided, wherein the electronic circuit comprises a first transistor and also a second transistor coupled in series with the first transistor. Furthermore, the electronic circuit comprises a capacitor, wherein a first terminal of the capacitor is coupled to a control terminal of the second transistor, and wherein a second terminal of the capacitor is coupled to an electrical potential which is dependent on a radio-frequency input signal of the electronic circuit.

Electronic circuit and electronic circuit arrangement

In an embodiment, an apparatus includes a source region, a gate region and a drain region supported by a substrate, and a drift region including a plurality of vertically extending n-wells and p-wells to couple the gate region and the drain region of a transistor, wherein the plurality of n-wells and p-wells are formed in alternating longitudinal rows to form a superjunction drift region longitudinally extending between the gate region and the drain region of the transistor.

Integrated circuit using a superjunction semiconductor device

The invention relates to a high-frequency integrated circuit requiring ESD protection for a circuit node. One or more metallic layer is deposited within the integrated circuit and patterned to form a transmission line. The metallic layers are generally already present in the integrated circuit for signal routing. The transmission line is coupled between the circuit node and a terminal of an ESD protection device, with a transmission line return conductor coupled to a high-frequency ground. The transmission line is formed with an electrical length that transforms the impedance of the ESD protection device substantially into an open circuit at the circuit node at an operational frequency of the integrated circuit. The other terminal of the ESD protection device is coupled to the high-frequency ground.

Integrated RF ESD protection for high frequency circuits

Growing community of inventors

Munich, Germany

Uwe Hodel