Agilent Technologies, Inc.

Hewlett-packard Company

Uwe Effelsberg

Hongfeng Yin

Manfred Berndt

Kevin P Killeen

Konstantin Shoykhet

Reid Alyn Brennen

Bettina Schuhn

Thomas Ortmann

Karsten G Kraiczek

Daniel Thielsch

Armin Steinke

Daniela Loraing

Ansgar Waldbaur

Matthias Kamuf

Manuel Van Venrooy

Michael Lang

Andreas Otto

Kyle Robert Busch

Lena Höninger

Matthias Wetzel

A process which, on the basis of a provided test sample including a mix of a plurality of pre-known sample components and on the basis of provided absolute sample separation properties for each of the sample components, includes experimentally determining a real sample separation result by executing a sample separation method for separating the test sample by a sample separation apparatus, and determining a real value of at least one operation parameter based on a comparison between the absolute sample separation properties and the real sample separation result for characterizing a real course of the sample separation method.

Using multi-component test sample for determining real parameter value of sample separation

A method of controlling a sample separation apparatus, for separating a fluidic sample using a mobile phase provided from at least one mobile phase container, includes determining a weight and volume reduction behavior according to which weight and volume of mobile phase in a mobile phase container are reduced during conveying mobile phase from the mobile phase container in the sample separation apparatus, and determining a tare weight of the mobile phase container based on a gross weight information, a volume information, and the determined weight and volume reduction behavior. The gross weight information is indicative of an initial gross weight of the mobile phase container including its mobile phase, and the volume information is indicative of an initial mobile phase volume in the mobile phase container.

Control of sample separation based on analysis of mobile phase supply from mobile phase container

A process of determining a modified separation method for a sample separation apparatus based on an initial separation method, including carrying out the initial separation method on a sample separation apparatus, detecting sensor data at the sample separation apparatus during carrying out the initial separation method, and carrying out a numerical analysis for determining the modified separation method by modifying at least one operation parameter of the initial separation method and by using the detected sensor data.

Adjusting separation method using sensor data and numerical analysis

A mounting device for mounting a sample separation unit configured for separating, preferably chromatographically separating, compounds in a fluidic sample includes a first fluid connector configured for being mechanically and fluidically coupled with a first fluid interface of the sample separation unit, a second fluid connector configured for being mechanically and fluidically coupled with a second fluid interface of the sample separation unit, and a swivel mechanism configured for swivelling the first fluid connector between a mounting orientation for mounting the first fluid interface of the sample separation unit at the first fluid connector and an alignment orientation for aligning the second fluid interface of the mounted sample separation unit with the second fluid connector for subsequently coupling the second fluid interface with the second fluid connector.

Mounting a sample separation unit by a swivel mechanism

A system and method of improving the thermal characteristics of a system having at least two electronic devices (100, 102; 300, 302) connected to a common substrate (104; 304). Thermal characteristics include the amount of heat transferred from one device to another and spatial uniformity of heat transferred from one device to another. Thermal conductive paths between two electronic devices are lengthened by forming an opening (200; 306) through the substrate between the two devices. Heat conduction between the devices is reduced due to increased radiation and convection in the longer thermal conductive paths. The uniformity of heat distribution between the devices is improved due to a narrower range of conducting path lengths. In a specific embodiment, heat conduction is reduced between amplifiers and photosensors used in spectrometers. In the specific embodiment, a temperature sensor (308) is used to further reduce thermal effects.

Electronic assembly having improved thermal characteristics

A method and apparatus for mounting an optical sensor in an optical instrument. The optical sensor is attached to a rigid substrate. The substrate has two locator holes, with the sensor mounted between the holes. Rigid locator pins attached to the housing of the instrument protrude into the locator holes. A spring pushing against the substrate forces the locator holes against corresponding locator pins, aligning the substrate within a plane. In a first embodiment, the holes are positioned so that the optical sensor is rigidly held at its midpoint, minimizing dimensional deviations along the length of the sensor with temperature change. The sensor assembly is easily removable and the mounting apparatus does not mechanically stress the substrate or the sensor with temperature changes. The mounting apparatus is easily manufactured, allows precise alignment, and is inexpensive.

Method and apparatus for temperature compensated optical sensor mounting

A photodiode structure for the detection of radiation comprises a semiconductor base layer of p-type conductivity with a high doping density, an epitaxial layer of p-type conductivity with a relatively low doping density, areas of n-type conductivity and oxide layers covering the areas of n-type conductivity. The oxide layers comprise doping impurities of the same conductivity type as the areas below them. The doping density in the areas of n-type conductivity decrease towards the junction with the epitaxial layer. Due to this decrease in doping density, an electric field gradient is produced which guides the charge carriers to the junction. The generation of a field gradient and the creation of a surface charge result in an improved quantum efficiency. The invention is preferably used in photodiode arrays. Due to the gradient in doping density in the epitaxial layer, charge carriers are reflected at the interface between the layers and so that cross talk between adjacent diodes in a photodiode array is reduced. According to a preferred method for manufacturing a photodiode structure of the invention, the doping of the photodiode structures is performed by ion implantation.

Photodiode structure

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Karlsruhe, Germany

Uwe Effelsberg