Litef Gmbh

Northrop Grumman Litef Gmbh

Uwe Breng

Eberhard Handrich

Wolfram Geiger

Bruno F Ryrko

Martin Hafen

Guenter Spahlinger

Maik Wiemer

Karla Hiller

Günter Spahlinger

Steffen Zimmermann

Detlef Billep

Bruno Rvrko

In a method for producing a component, a first layer composite is first produced, comprising a structured layer and a trench filled with an insulating material. The structured layer is electrically conductive at least in a first region. The trench filled with an insulating material extends outwards from a first surface of the structured layer and is arranged in the first region of the structured layer. The first surface of the structured layer faces a first surface of the first layer composite. The method additionally has the step of producing a second layer composite, which has a first depression in a first surface of the second layer composite, and the step of connecting the first layer composite to the second layer composite. The first surface of the first layer composite adjoins the first surface of the second layer composite at least in some regions, said filled trench being arranged within the lateral position of the first depression. After the first layer composite has been connected to the second layer composite, the thickness of the first layer composite from a second surface of the first layer composite to the depth of the filled trench is reduced. The second surface of the first layer composite lies opposite the first surface of the first layer composite. The method further has the step of producing an active structure in the structured layer, said active structure comprising two second regions which are arranged in the first region of the structured layer and which are mechanically connected to each other in a rigid manner but are electrically insulated from each other by means of the filled trench.

Method for producing a component

A method for producing a component, especially a micromechanical, micro-electro-mechanical or micro-opto-electro-mechanical component, as well as such a component which has an active structure that is embedded in a layer structure. Strip conductor bridges are formed by etching first and second depressions having a first and second, different etching depth into a covering layer of a first layer combination that additionally encompasses a substrate and an insulation layer. The deeper depression is used for insulating the strip conductor bridge while the shallower depression provides a moving space for the active structure with the moving space being bridged by the strip conductor bridge.

Method for the production of a component, and component

A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites. Contact holes are formed for making contact with conductive regions of the structure layer within the first and/or second substrate.

Micromechanical component and method for fabricating a micromechanical component

A method for producing a silicon torsion spring capable, for example, of reading the rotation rate in a microstructured torsion spring/mass system. The system that is produced achieves a low torsional stiffness compared to a relatively high transverse stiffness in the lateral and vertical directions. The method proceeds from a wafer or wafer composite and, upon suitable mask coverage, a spring with a V-shaped cross section is formed by anisotropic wet-chemical etching which preferably extends over the entire wafer thickness and is laterally delimited only by [111] planes. Two of the wafers or wafer composites prepared in this way are rotated through 180&#xb0; and joined to one another oriented mirrorsymmetrically with respect to one another, so that overall the desired X-shaped cross section is formed.

Method for producing a torsion spring

A micromechanical rotation rate sensor based on the Coriolis principle includes two plate-like oscillators arranged one above the other in two planes for excitation to oscillate by means of an electrostatic drive. Three elements in each case form an oscillator structure. The oscillators are in each case suspended on opposite side edges by at least one web between an associated plate-like support and an associated drive plate element. The two supports and the two drive plate elements are, in each case, arranged one above the other in layers. A fixed plate element is located between the two drive plate elements so that, in each case, an identical narrow drive gap is defined between the drive plate elements. The drive gap is considerably smaller than the distance between the plate-like oscillators. An intermediate support that fills the intermediate space is inserted between the two plate-like supports and is completely electrically isolated from the surrounding frame to further reduce the respective capacitances to be recharged. The invention reduces the electrodynamic coupling between the drive and the read-out by a factor of about 100 in comparison with known micromechanical rotation rate sensors of like design.

Micromechanical rpm sensor

Strictly out-of-phase stimulation of the two oscillators of a micro-mechanical rate-of-rotation sensor based on the Coriolis principle, having two-plate like oscillators arranged in layers one above another in two parallel planes and capable of being stimulated to oscillate perpendicular to the planes by means of an electrostatic drive, is achieved by the oscillators each being connected via at least one spring to a couple element formed, in each case, in the same wafer layer. The couple elements are mirror-symmetrically configured with respect to a mid-plane between the oscillators and connected to each other by a coupling web arranged therebetween to form a couple structure for the oscillators.

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Gundelfingen, Germany

Uwe Breng