Intel Corporation

Usman Mughal

Chee How Lim

Razi Uddin

Songmin Kim

Keng L Wong

Gregory F Taylor

Steven A Peterson

Raghu P Raman

George L Geannopoulos

David E Duarte

Kent R Callahan

Mathew B Nazareth

Kedar Mangrulkar

Venkatesh Prasanna

Masud Kamal

Steve A Peterson

Vijayalakshmi Ramachandran

An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Accurate on-die temperature measurement using remote sensing

A method and apparatus for a frequency-based slope-adjustment circuit block are described herein.

Frequency-based slope-adjustment circuit

A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated based on matching an internal impedance generated by transistors with an impedance of the external impedance element, and then the reference impedance code can be shifted to generate new impedance codes according to impedance requirements of various different circuits that require compensation. Use of the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs. Chip area is also conserved since simpler compensation circuits can be used.

Apparatus and method to provide a single reference component for multiple circuit compensation using digital impedance code shifting

A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated from a master circuit, and then the reference impedance code is shifted to generate a slave impedance code. The slave impedance code is provided to one or more slave circuits to activate devices in the slave circuit(s). Impedance-generation devices coupled to the slave circuit are then activated one at a time until their generated impedance corresponds to the impedance generated by the slave circuit. The reference impedance code can be incremented or decremented (e.g., shifted) to generate slave impedance codes corresponding to different impedance values, according to impedance requirements of various different circuits that require compensation.

Apparatus and method to use a single reference component in a master-slave configuration for multiple circuit compensation

A lock detector system which operates adaptively based on a frequency of operation. Different lock windows are defined for different frequencies of operation and are automatically formed based on the controlled signal that is used to drive the voltage controlled oscillator of the phase locked loop.

Variable lock window for a phase locked loop

A single external impedance element is used to perform multiple circuit compensation. A reference impedance code is first generated from a master circuit, and then the reference impedance code is provided (as a slave impedance code) to one or more slave circuits to activate devices in the slave circuit(s). Impedance-generation devices coupled to the slave circuit are then activated one at a time until their generated impedance corresponds to the impedance generated by the slave circuit. The reference impedance code can be incremented or decremented (e.g., shifted) to generate slave impedance codes corresponding to different impedance values, according to impedance requirements of various different circuits that require compensation. Using the single external impedance element for compensation of multiple circuits reduces motherboard and packaging costs.

A circuit board has a transmission line. A connector is coupled to the circuit board and electrically coupled to the transmission line. Bus termination circuitry is electrically coupled to the transmission line at or near an end of the transmission line at the connector such that the transmission line is terminated by the bus termination circuitry when the connector is not engaged to support any device for electrical coupling to the transmission line.

Bus termination scheme for flexible uni-processor and dual processor platforms

A technique for compensating a characteristic, such as a resistance, of at least one circuit includes selectively incrementing a characteristic of a dummy circuit and comparing it with a characteristic of an external reference to generate a reference code. A previous reference code is stored and subsequently compared with a present reference code. It is ensured that the present reference code differs by no more than a predetermined amount from the stored previous reference code by ceasing the incrementing or decrementing of the characteristic of the dummy circuit and utilizing the present reference code to compensate the characteristic of the at least one circuit.

Circuit compensation technique

A pull-up circuit has substantially linear current-voltage (I-V) characteristics for use in a bus system, such as in an open drain bus architecture type system. Operation in the linear region of the I-V characteristics is useful in high frequency input/output circuits. The pull-up circuit includes a transistor and a single termination resistor coupled to the transistor, and is simpler than other types of pull-up circuits. This simplicity in design saves area on a chip. The termination resistor in the pull-up circuit can be an n-well resistor formed on the same chip as the transistor, thereby further contributing to the savings in chip area.

Apparatus and method for linear on-die termination in an open drain bus architecture system

In a system, such as an open-drain bus architecture system, a termination impedance can be dynamically coupled or de-coupled from a bus. The termination impedance is coupled to the bus by a dynamic control circuit if a signal is being received from the bus or if a binary 1 is driven on the bus. The termination impedance is de-coupled from the bus by the dynamic control circuit if a binary 0 is driven on the bus. Coupling the termination impedance to the bus improves signal quality by providing a matching impedance. De-coupling the termination impedance reduces power dissipation and improves receiver noise margin.

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Hillsboro, OR, United States of America

Usman Mughal