Texas Instruments Corporation

Usman Mahmood Chaudhry

Rajen Manicon Murugan

Yiqi Tang

Donald Charles Abbott

Anindya Poddar

Kurt Peter Wachtler

Abram M Castro

Enis Tuncer

John Paul Tellkamp

Satyendra Singh Chauhan

Tony Ray Larson

Jie Chen

Mahmud Halim Chowdhury

Ming Li

Joe Adam Garcia

Li Jiang

Robert J Falcone

An electronic device includes a rectangular ceramic package structure having opposite first and second sides, an interior cavity that extends to an opening in the second side, opposite third and fourth sides spaced along a first direction, opposite fifth and sixth sides spaced along an orthogonal second direction, and non-conductive indents extending into the third and fourth sides. The device also includes a semiconductor die in the cavity, a lid that covers the opening and seals the cavity, a conductive terminal having a planar side exposed along the first side that is electrically coupled to a circuit of the semiconductor die and extends to a first one of the non-conductive indents, and conductive pins spaced apart from the conductive terminal and extending outward from the first side of the ceramic package structure along a third direction.

Hybrid chip carrier package

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same

A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including&#x2265;1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to &#x2265;1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.

Hall-effect sensor package with added current path

Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.

Electronic package for integrated circuits and related methods

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).

A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including &#x2265;1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to &#x2265;1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.

In a method and apparatus for fabricating a semiconductor device having a flexible tape substrate, a hole is punched in the flexible tape substrate. The flexible tape substrate includes a metal layer attached to a polyimide layer without an adhesive there between. A cover is placed on the metal layer to cap a base of the hole. A metal is deposited on the cover exposed at the base of the hole, the metal being used to form a bond with the metal layer. The metal being deposited causes the hole to be plugged up to a selective height. Upon removal of the cover, the metal may also be deposited on the metal layer to increase a thickness of the metal layer.

Growing community of inventors

McKinney, TX, United States of America

Usman Mahmood Chaudhry