International Business Machines Corporation

Globalfoundries Inc.

Essilor International (Compagnie Generale D'optique)

Urs Kloter

Bruno Michel

Thomas J Brunschwiler

Hugo Eric Rothuizen

Ryan Joesph Linderman

Ryan Joseph Linderman

Jean-Paul Cano

Heinz Schmid

Gerhard Keller

Reto Waelchli

Reio Waelchli

Hugo E Rothuizen

The invention relates to a cooling arrangement comprising a heat spreader () comprising a first surface (), a second surface (), at least one heat absorption chamber () and at least one heat dissipation chamber (), the at least one heat absorption chamber () being in thermal contact with the first surface () and the at least one heat dissipation chamber () being in thermal contact with the second surface () and hydraulically coupled to the at least one heat absorption chamber (). A cooling fluid () can be driven from the heat absorption chamber () to the heat dissipation chamber () using a plurality of flow patterns for cooling the first surface ().

Method and device for cooling a heat generating component

A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.

Cooling device

A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.

Patterned structure for a thermal interface

A stamp for patterning onto a receiving surface of an object () according to a defined pattern (P) comprises a stamping surface () of a resilient diaphragm (). The stamping surface is planar at rest. The pattern is reproduced on the stamping surface and the diaphragm is affixed to a rigid body () along a peripheral edge, so that a middle part of the diaphragm can move along a direction perpendicular to the stamping surface. The diaphragm () is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface () using the stamp exhibits few distortion.

Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp

The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.

A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.

Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies

A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.

Semiconductor chip assembly with flexible metal cantilevers

An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.

Growing community of inventors

Dietikon, Switzerland

Urs Kloter