Infineon Technologies Ag

Elaphe Pogonske Tehnologije D.o.o.

Urban Medic

Tomasz Naeve

Eung San Cho

Petteri Palm

Gorazd Lampic

Milad Mostofizadeh

Tomaz Motaln

An electronic device is disclosed. In one example, the electronic device comprises a carrier board, a metal inlay having a cavity and being arranged in the carrier board. At least one electronic component is arranged at least partially in the cavity and embedded in the carrier board. Electric contacts are located at a castellated edge of the carrier board.

Electronic device with castellated board

A semiconductor assembly includes a semiconductor package that includes first and second transistor dies embedded within a package body, the first and second transistor dies being arranged laterally side by side within the package body such that a first load terminal of the first transistor die faces an upper surface of the package body and such that a second load terminal of the second transistor die faces the upper surface of the package body, and a discrete capacitor mounted on the semiconductor package such that a first terminal of the discrete capacitor is directly over and electrically connected to the first load terminal of the first semiconductor die and such that a second terminal of the discrete capacitor is directly over and electrically connected with the second load terminal of the second semiconductor die.

Semiconductor package with low parasitic connection to passive device

Growing community of inventors

Logatec, Slovenia

Urban Medic