Cisco Technology, Inc.

Upendranadh Reddy Kareti

Joel Richard Goergen

Amendra Koul

Mike Sapozhnikov

David Nozadze

Tomer Osi

Sayed Ashraf Mamun

Phillip S Ting

Gary L Myers

Kamran Esmaily

An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

Integrated circuit package with heatsink

Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.

Twinaxial cable port structure coupled to an integrated circuit socket

In one embodiment, a transmission system includes a transmitter, a receiver, and a filter operable at one of the transmitter and the receiver to remove channel impairments. The filter is operable according to a sum of a Gaussian function and a reciprocal of cosine function, wherein the Gaussian and reciprocal of cosine functions comprise tunable parameters to account for skew and channel asymmetry.

Removal of channel impairments due to skew and channel asymmetry with a composite filter

An apparatus, in accordance with particular embodiments, includes a shell comprising two substantially parallel surfaces. The apparatus further includes a plurality of connector housings mounted between the two substantially parallel surfaces. The apparatus also includes a plurality of connectors coupled to the plurality of connector housings. Each connector is configured to move along at least one axis within its respective connector housing. The apparatus further includes a plurality of cables. Each cable is configured to couple together at least two connectors. The plurality of cables are arranged between the two substantially parallel surfaces.

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Union City, CA, United States of America

Upendranadh Reddy Kareti