Applied Materials, Inc.

Bose Corporation

Kla Tencor Corporation

Clearmotion Acquisition I LLC

Clearmotion Acquisition L LLC

Upendra V Ummethala

Blake Erickson

Michael C Kutney

Chuang-Chia Lin

Philip Allan Kraus

Keith R Berding

Lei Lian

David J Warkentin

Zhaozhao Zhu

Patrick John Tae

Tao Zhang

Devendra Channappa Holeyannavar

Steven Trey Tindel

Prashanth Kumar

Shivaraj Manjunath Nara

Sivasankar Nagarajan

Anandakumar Parameshwarappa

Dhirendra Kumar

James A Parison

Layton Hale

Mark F Williams

Roman N Litovsky

Michael N Grimbergen

Ajit Balakrishna

Samir A Nayfeh

Steven E Babayan

Pengyu Han

John Anthony O'Malley

Andrew Wilson

Daniel Francis Opila

Arvind Sundarrajan

Marco Giovanardi

Guan Huei See

Lawrence D Knox

Glen T Mori

William R Short

Dariusz Antoni Bushko

Amar G Bose

Wade P Torres

Marek Zywno

Prayudi Lianto

Vivek Bharat Shah

Joshua Randall Clyne

Surajit Kumar

Paul Thomas Bender

Steven N Brown

Thomas C Schroeder

Neal M Lackritz

Joseph A Di Regolo

Varoujan Chakarian

Joseph A DiRegolo

Linda T Scully

Gaurav Mehta

Ramesh Chidambaram

Pin Gian Gan

Linda Ystueta

Amulya Ligorio Athayde

Sik Hin Chi

Andrew Choe

Shih-Chao Hung

Ricardo Fujii Vinluan

Wei Hao Kew

Muhammad Adli Danish Bin Abdullah

Josh Clyne

Mark McTaggart Wylie

Thomas C Shroeder

Paul Bender

Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

Smart camera substrate

A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.

Substrate measurement subsystem

A method includes receiving, from one or more sensors, sensor data associated with manufacturing equipment and updating one or more values of a digital replica associated with the manufacturing equipment based on the sensor data. The digital replica comprises a model reflecting a virtual representation of physical elements and dynamics of how the manufacturing equipment operates. One or more outputs indicative of predictive data is obtained from the digital replica and, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment is caused.

Performing radio frequency matching control using a model-based digital twin

A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.

Integrated substrate measurement system to improve manufacturing process performance

Implementations disclosed describe a collimator assembly having a collimator housing that includes an interface configured to optically couple to a process chamber that has a target surface, and a port to receive an optical fiber to deliver, to an enclosure formed by the collimator housing, a first (second) plurality of spectral components of light belonging to a first (second) range of wavelengths, and an achromatic lens located, at least partially, within the enclosure formed by the collimator housing, the achromatic lens to direct the first (second) plurality of spectral components of light onto the target surface to illuminate a first (second) region on the target surface, wherein the second region is substantially the same as the first region.

Adjustable achromatic collimator assembly for endpoint detection systems

A concentration sensor assembly can include a vaporization chamber having a compound. The concentration sensor assembly may include a first flow path coupled to the vaporization chamber. The first flow path may direct a first gas to the vaporization chamber. A second flow path can direct a second gas out of the vaporization chamber. The second gas can include the compound and the first gas. A first sensor is disposed along the first flow path. The first sensor measures first data indicative of a first mass flow rate of the first gas. A second sensor is disposed along the second flow path. The second sensor measure second data indicative of a second mass flow rate of the second gas. A computing device may determine a concentration of the vaporizable substance within the second gas based on the first data and the second data.

Concentration sensor for precursor delivery system

A method includes causing manufacturing equipment to generate a RF signal to energize a processing chamber associated with the manufacturing equipment. The method further includes receiving, from one or more sensors associated with the manufacturing equipment, current trace data associated with the RF signal. The method further includes updating impedance values of a digital replica associated with the manufacturing equipment based on the current trace data. The method further includes obtaining, from the digital replica, one or more outputs indicative of predictive data. The method further includes causing, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment.

Embodiments disclosed herein include optical sensor systems and methods of using such systems. In an embodiment, the optical sensor system comprises a housing and an optical path through the housing. In an embodiment, the optical path comprises a first end and a second end. In an embodiment a reflector is at the first end of the optical path, and a lens is between the reflector and the second end of the optical path. In an embodiment, the optical sensor further comprises an opening through the housing between the lens and the reflector.

In-situ optical chamber surface and process sensor

A non-transitory computer-readable storage medium stores instructions, which when executed by a processing device of a diagnostic server, cause the processing device to perform certain operations. The operations include receiving, from a processing chamber, (i) measurement values of a combined signal that is based on an injection of an alternating signal wave onto a first output signal of a controller of the processing chamber, and (ii) measurement values of a second output signal of the controller that incorporates feedback from the processing chamber. The operations further include generating, based on the measurement values of the combined signal and the measurement values of the second output signal of the controller, a baseline bode fingerprint pertaining to a state associated with the processing chamber. The operations further include storing, in computer storage, the baseline bode fingerprint to be used in performing diagnostics of the processing chamber.

Bode fingerprinting for characterizations and failure detections in processing chamber

A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored. A determination is made based on the first set of measurements mapped to the second set of measurements for the substrate of whether to modify the first process recipe or a second process recipe for the substrate.

Portion of a display panel with a graphical user interface

Embodiments disclosed herein include an optical sensor system for use in plasma processing tools. In an embodiment, the optical sensor system, comprises an optically clear body with a first surface and a second surface facing away from the first surface. In an embodiment, the optically clear body further comprises a third surface that is recessed from the second surface. In an embodiment, the optical sensor system further comprises a target over the third surface and a first reflector to optically couple the first surface to the target.

Optical wall and process sensor with plasma facing sensor

Growing community of inventors

Cupertino, CA, United States of America

Upendra V Ummethala