Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Ung Hui Shin

Doo Hwan Lee

Dae Jung Byun

Byung Ho Kim

Joo Young Choi

Jong Rip Kim

Pyung Hwa Han

Kyung Seob Oh

Hyoung Joon Kim

Sung Hwan Cho

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; and an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip. The first interconnection member includes a first insulating layer in contact with the second interconnection member, a first redistribution layer disposed on a surface of the first insulating layer in contact with the second interconnection member and electrically connected to the connection pads, and a blocking layer disposed on the surface of the first insulating layer on which the first redistribution layer is disposed and surrounding the through-hole.

Fan-out semiconductor package

There are provided a printed circuit board and a method to manufacture the same. The printed circuit board includes a core board including an insulating layer and a cavity, an electronic element in the cavity, and an insulating member disposed between inner surfaces of the cavity and the electronic element. A modulus of elasticity of the insulating member is lower than a modulus of elasticity of the insulating layer.

Printed circuit board

An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connected to the electronic component, and an encapsulation material encapsulating the electronic component and having an elastic modulus smaller than that of a material constituting the frame.

Electronic component package and method of manufacturing the same

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Suwon-si, South Korea

Ung Hui Shin