Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

Unal Murat Guruz

Vladimir Nikitin

David John Seagle

Edward Hin Pong Lee

Douglas Johnson Werner

David Patrick Druist

Darrick Taylor Smith

Glenn Paul Gee

Mary Kathryn Gutberlet

Michael Ming Hsiang Yang

Yuan Yao

Yvette Chung Nga Winton

Edward H Lee

Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 &#x3bc;m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Wafer grounding design for single pad lapping

A method for manufacturing a magnetic head for magnetic data recording, that allows a lapping termination point to be easily and accurately determined during lapping. The method includes constructing a lapping guide that has an electrically is formed to provide an abrupt change in resistance at a point where lapping should be terminated. This point of abrupt resistance change is located relative to the flare point of the write pole that the distance between the flare point and the air bearing surface can be accurately maintained. This abrupt resistance change also makes it possible to monitor both a stripe height defining rough lapping and an angled kiss lapping process using a single measurement channel.

Method for manufacturing a slider for a perpendicular magnetic recording head

Both the wafer serial number and slider region location indicia on the wafer are formed on the front surface of the wafer using optical principles, i.e., without using a laser.

System and method for forming serial numbers on HDD wafers

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San Jose, CA, United States of America

Unal Murat Guruz