Applied Materials, Inc.

Umesh M Kelkar

Kartik Bhupendra Shah

Anantha K Subramani

Ala Moradian

Jianming Fu

Praburam Gopalraja

Karthik Ramanathan

Elizabeth Neville

Orlando Trejo

Joseph Michael Ranish

Prashanth Kothnur

Mats Larsson

Kevin A Papke

Maurice E Ewert

Chandrasekhar Balasubramanyam

Karthikeyan Balaraman

Balamurugan Ramasamy

Rajasekhar Patibandla

Sergey Meirovich

John C Forster

Xianmin Tang

Lara Hawrylchak

Dien-Yeh Wu

Yu Lei

Kadthala Ramaya Narendrnath

Xiaoxiong Yuan

Kazuya Daito

Yi Xu

Jeffrey A Tobin

Govinda Raj

Goichi Yoshidome

Vikash Banthia

Kevin Joseph Bautista

Nitin Khurana

Mark Robert Denome

Pingyan Lei

Chaitanya A Prasad

Bopanna Ichettira Vasantha

Sathyanarayana Bindiganavale

Ludovic Godet

Juan Carlos Rocha-Alvarez

Vijay D Parkhe

Joseph Yudovsky

Jeonghoon Oh

Christopher Sean Olsen

Jian Li

Karthik Janakiraman

Zheng Yuan

Rui Cheng

Prashant Kumar Kulshreshtha

Alan A Ritchie

Lin Zhang

Vinay K Prabhakar

Semyon Sherstinsky

Gopalakrishna B Prabhu

Diwakar N Kedlaya

Zubin Huang

Agus Sofian Tjandra

Kalyanjit Ghosh

Sarah Michelle Bobek

Shuran Sheng

Jun Xue

Matthew D Scotney-Castle

Venkata Sharat Chandra Parimi

Shreyas Kher

Donny Young

Wei Yang

Paul F Smith

Satish Radhakrishnan

Nety M Krishna

Marc O Schweitzer

Kathleen Ann Scheible

James Omer L'Heureux

Leonel Arturo Zuniga

Byung Seok Kwon

Alan R Popiolkowski

Ted G Yoshidome

Nalin Patadia

Ashok K Das

William M Lu

Ilyoung (Richard) Hong

Chirag Shaileshbhai Khairnar

Rod Mosely

Alison Gilliam

Scot Petitt

Rohit Mahakali

A first selection of a first fabrication process and/or first manufacturing equipment to perform manufacturing operations of the first fabrication process is received. The first selection is input into a digital replica of the first manufacturing equipment, where the digital replica outputs physical conditions of the first fabrication process. Environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process is determined. A modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment is determined. Applying the modification to the first fabrication and/or providing the modification for display by a graphical user interface (GUI) is performed.

Eco-efficiency (sustainability) dashboard for semiconductor manufacturing

Technologies directed to cooling flow according to predicted cooling parameters for substrate processing are described. In some embodiments, a method includes receiving first data indicative of a process recipe for processing a substrate in a processing chamber of a substrate processing system. The method further includes inputting the first data into a model. The model includes a digital twin configured to represent thermal characteristics of the processing chamber. The method further includes receiving, via the model, a predicted value of a parameter associated with a flow of coolant through a cooling loop of the processing chamber. The method further includes causing coolant to flow through the cooling loop based on the predicted value of the parameter during execution of the process recipe in the processing chamber.

Cooling flow in substrate processing according to predicted cooling parameters

Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).

Eco-efficiency monitoring and exploration platform for semiconductor manufacturing

A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment. The method can further include performing at least one of applying the modification to the first fabrication.

Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.

Heated pedestal design for improved heat transfer and temperature uniformity

Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20&#xb0; C. to about 300&#xb0; C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.

Protection of aluminum process chamber components

A method includes receiving measurement data from multiple sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a processing chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater jackets positioned around the delivery line; comparing the measurement data with values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that a fault exists that is associated with maintaining temperature within the delivery line consistent with a gaseous state of the liquid.

Parameter sensing and computer modeling for gas delivery health monitoring

One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SiYMgAlO. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SiYMgAlO.

Method for fabricating chamber parts

A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

3D printed chamber components configured for lower film stress and lower operating temperature

Embodiments of a blocker plate for use in a substrate process chamber are disclosed herein. In some embodiments, a blocker plate for use in a substrate processing chamber configured to process substrates having a given diameter includes: an annular rim; a central plate disposed within the annular rim; and a plurality of spokes coupling the central plate to the annular rim.

Blocker plate for use in a substrate process chamber

Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.

Protective layers for processing chamber components

Embodiments described herein relate to a showerhead having a reflector plate with a gas injection insert for radially distributing gas. In one embodiment, a showerhead assembly includes a reflector plate and a gas injection insert. The reflector plate includes at least one gas injection port. The gas injection insert is disposed in the reflector plate, and includes a plurality of apertures. The gas injection insert also includes a baffle plate disposed in the gas injection insert, wherein the baffle plate also includes a plurality of apertures. A first plenum is formed between a first portion of the baffle plate and the reflector plate, and a second plenum is formed between a second portion of the baffle plate and the reflector plate. The plurality of apertures of the gas injection insert and the plurality of apertures of the baffle plate are not axially aligned.

Showerhead design

Growing community of inventors

Santa Clara, CA, United States of America

Umesh M Kelkar