Siemens Aktiengesellschaft

Merck Patent Gesellschaft MIT Beschrankter Haftung

Ulrike Reeh

Hans Denk

Ernst Wipfelder

Ludwig Pohl

Guenther Waitl

Reiner Habrich

Kurt Marquard

Klaus Hoehn

Reinhard Hollaus

Josef Lang

G Unter Waitl

Inorganic fillers and organic matrix materials with refractive index

A casting resin system containing epoxyalkylsiloxane is provided for covering optoelectronic components. The casting resin system includes a resin constituent containing a mixture of epoxyalkylsiloxanes and cycloaliphatic epoxy resins. The casting resin system can be hardened with a polycarboxylic acid anhydride as a hardener component to form molding materials that are transparent and color-stable.

Casting resin of epoxyalkylsiloxane, epoxy resin and anhyride

A photovoltaic solar module having at least one solar cell embedded in synthetic resin and resting on a flexible supporting element and which further includes a sheet-like rigid element reinforcing the solar cell.

Photo-voltaic solar module

The invention relates to a method for the manufacture of transparent casting resins. According to the invention, a liquid acid anhydride (b) is admixed to a premixture (a), which is liquid at room temperture, of zinc octoate, a low-molecular weight acid ester and, optionally, an organic phosphite, and this mixture of (a) and (b) is added, preferably at temperatures .ltoreq.50.degree. C., to liquid aromatic diglycidyl ethers. Diphenyldecyl phosphite is particularly well suited as an organic phosphite. The casting resins obtained are transparent and find use particularly for casting-in and encapsulating opto-electronic components such as light-emitting diodes (and diode displays), photo diodes and photo transistors.

Method for the preparation of transparent casting resins

The invention relates to quick-setting epoxy resin compounds of carboxylic-acid anhydrides, diglycidyl esters and zinc octoate as accelerator, dissolved in a low-molecular acid ester and optionally, an organic phosphorus compound. Particularly well suited diglycidyl esters are hexahydrophthalic-acid diglycidyl ester, phthalic-acid diglycidyl ester, tetrahydrophthalic-acid diglycidyl ester and aliphatic diglycidyl esters. The epoxy resin compounds can be used for casting resin and molding compounds as well as for adhesive and impregnating materials. They find particular use for electrical components and modules.

Quick-setting epoxy resin compounds

Casting resin compositions for sealing opto-electronic components on the basis of quick-setting casting resin compounds, consisting of at least one epoxy compound with a cycloaliphatic base with at least two oxiran rings in the molecule, at least one carbonic acid anhydride, a zinc octoate, a low-molecular polyol and/or a low-molecular acid ester and, optionally, an organic phosphorus compound and customary brighteners and light-scattering material in powder form and pigments. Especially suitable is a zinc octoate with a zinc content of 21 to 22% by weight. The compounds are used for covering and coating light-emitting diodes, photo transistors, photo diodes and light-emitting diode displays and as light guides for opto-electronic couplers.

Growing community of inventors

Munich, Germany

Ulrike Reeh