Huntsman Advanced Materials Americas LLC

Ciba Specialty Chemicals Corporation

Huntsman International LLC

Vantico Limited

Huntsman Advanced Materials LLC

Huntsman Advanced Materials Licensing Gmbh

Ulrich Weidmann

Philip David Willis

Felix Bleuel

Dean Tallak Behm

Hans-Fred Buchmann

Dieter Glauch

Frans Setiabudi

Chantal Hubschmid

Philippe Michaud

Celine Meunier

Franck Magendie

Preparation of poly amidoimides

The instant invention relates to epoxy resin compositions comprising an epoxy resin, a block copolymer having at least one block predominantly composed of methyl methacrylate units or a core shell component and a hardener of the polyoxyalkyleneamine type. The epoxy materials cured from these compositions have high impact resistance.

Toughened composition

Composition comprising as component A) a 1-imidazoly[mothyl-substituted 2-naphthol compound of the general formula (I) where R, Rand Reach independently of one another are H; Calkyl; Ccycloalkyl, optionally substituted byalkyl groups; C4cycloalkyl-alkyl, optionally substituted by Calkyl groups; Caryl, optionally substituted by 1-3 C-alkyl groups; C,phonylalkyl, optionally substituted by 1-3 Calkyl groups; Calkenyl; Calkynyl; or aromatic or aliphatic Cacyf; R, R, R, R, R, and Reach independently of one another are H; Calkyl; Ccycloalkyl, optionally substituted by Calkyl groups; Ccycloalkyl-alkyl, optionally substituted by Calkyf groups; Caryl, optionally substituted by 1-3 Calkyl groups; Cphenylalkyl, optionally substituted by 1-3 Calkyl groups; Calkenyl; Calkynyl; Calkoxy; or OH; and as component B) a phenol which is liquid at room temperature, the weight ratio of component A) to component B) being from 10:90 to 80:20 as accelerator for curable epoxy resin compositions which are used as a compression moulding compound, sinter powder, encapsulating system, casting resin, or for producing prepregs and laminates having very good interlaminar shear strength values using impregnating methods or injection methods, for producing components, especially components of large surface area.

Accelerator systems for low-temperature curing

Compounds of the general formulae (I) and (II): where R, Rand Reach independently of one another are H; Calkyl; Ccycloalkyl, optionally substituted by Calkyl groups; Ccycloalkyl-alkyl, optionally substituted by Calkyl groups; C, aryl, optionally substituted by 1-3 Calkyl groups, &#x2014;CN, Hal, OH, or Calkoxy; Cphenylalkyl, optionally substituted by 1-3 Calkyl groups; Calkenyl; Calkynyl; or aromatic or aliphatic Cacyl; R, R, R, R, R, and Reach independently of one another are H; Calkyl, Ccycloalkyl, optionally substituted by Calkyl groups; Ccycloalkyl-alkyl, optionally substituted by Calkyl groups; Caryl, optionally substituted by 1-3 Calkyl groups; Cphenylalkyl, optionally substituted by 1-3 Calkyl groups; Calkenyl; Calkynyl; Calkoxy; or OH; for formula (1) R is Calkyl; Ccycloalkyl, optionally substituted by Calkyl groups; Ccycloalkyl-alkyl; optionally substituted by Calkyl groups; Caryl, optionally substituted by 1-3 Calkyl groups; Cphenylalkyl, optionally substituted by 1-3 Calkyl groups; Calkenyl; or Calkynyl; and for formula (II) n=2-12; as accelerators in curable epoxy resin compositions which are used as a compression moulding compound, sinter powder, encapsulating system, or casting resin, or for producing prepregs and laminates having very good interlaminar shear strength values using the resin infusion method, wet layup method and injection methods, for producing components, especially components of large surface area. 

1-imidazolymethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing

A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing tertiary amine. The epoxy resin matrix composition is used as an impregnating resin to form impregnated fiber composite materials.

Epoxy resin composition

Compounds of formula (I) or (II), wherein Ris C&#x2013;Calkyl; C&#x2013;Ccycloalkyl that is unsubstituted or substituted by one or more C&#x2013;Calkyl groups or C&#x2013;Calkoxy groups; C&#x2013;Caryl that is unsubstituted or substituted by one or more C&#x2013;Calkyl groups or C&#x2013;Calkoxy groups; or C&#x2013;Caralkyl that is unsubstituted or substituted by one or more C&#x2013;Calkyl groups or C&#x2013;Calkoxy groups, and the radicals Rto Rare each independently of the others hydrogen; &#x2014;NO; dialkylamino; alkylthio; alkylsulfonyl; halogen; C&#x2013;Calkyl; C&#x2013;Calkoxy; C&#x2013;Calkoxyalkyl; C&#x2013;Ccycloalkyl that is unsubstituted or substituted by one or more C&#x2013;Calkyl groups or C&#x2013;Calkoxy groups; C&#x2013;Caryl that is unsubstituted or substituted by one or more C&#x2013;Calkyl groups or C&#x2013;Calkoxy groups; or C&#x2013;Caralkyl that is unsubstituted or substituted by one or more C&#x2013;Calkyl groups or C&#x2013;Calkoxy groups, are suitable as flame-proofing agents for thermoplastic or thermosetting polymers 

Flame-proofing agents

Process for impregnating electrical coils, and selected epoxy composition for carrying out the impregnation

A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents:

Process for impregnating electrical coils

Curable epoxy resin compositions

Growing community of inventors

Basel, Switzerland

Ulrich Weidmann