Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Gesellschaft MIT Beschrankter Haftung

Ams-osram International Gmbh

Osram S.p.a. - Societa' Riunite Osram Edison Clerici

Ulrich Streppel

Désirée Queren

Peter Brick

Ales Markytan

Michael Brandl

Christopher Wiesmann

Norwin Von Malm

Siegfried Herrmann

Jürgen Moosburger

Julius Muschaweck

Ion Stoll

Thomas Bemmerl

Bert Braune

Jan Marfeld

Sebastian Wittmann

Gerhard Kuhn

David Racz

Simon Schwalenberg

Mikko Perälä

Rainer Huber

Hailing Cui

Simone Capeleto

Christian Gaertner

Christopher Kölper

Ulrich Frei

Stefan Morgott

Ludwig Hofbauer

Ludwig Plötz

Christian Gärtner

Katrin Schroll

Marco Antretter

Georg Roßbach

Andreas Reith

Dajana Durach

Thomas Birke

Rainer Bradl

A backlighting unit comprises a carrier having a top side arranged parallel to an x-y-plane, a reflector assemblage arranged over the carrier in a z-direction, an optical assemblage arranged over the reflector assemblage in the z-direction, and a diffuser arranged over the optical assemblage in the z-direction. A cell of the backlighting unit comprises a section of the carrier having an optoelectronic semiconductor chip arranged on the top side, a reflector of the reflector assemblage, an optical element of the optical assemblage, and a section of the diffuser. The reflector has a concave mirror surface. The optical element has a front side facing the reflector and a rear side facing away from the reflector. The front side is subdivided into front-side surface sections arranged in a matrix-type fashion. The rear side is subdivided into rear-side surface sections arranged in a matrix-type fashion.

Backlighting unit with a reflector, a diffuser, and an optical assembly

Optoelectronic arrangement is proposed for use in a transparent glazing element of a vehicle, for example. The arrangement comprises at least one substantially transparent carrier layer, at least one conductor layer comprising conductor paths provided on at least one side of said carrier layer, at least one light emitting element arranged on the carrier layer and electrically coupled to conductor paths on said conductor layer and at least one proximity and/or touch sensor arranged on at least one of said carrier layers, the arrangement further being couplable to a control module for controlling the operation of said at least one light emitting element in response to information from said at least one proximity and/or touch sensor.

Optoelectronic arrangement

A radiation-emitting component is specified with—a carrier which has a top surface a radiation-emitting semiconductor chip arranged on the top surface of the carrier and configured to generate primary electromagnetic radiation, a first reflector layer arranged above a top surface of the semiconductor chip, and a cover body arranged between the first reflector layer and the radiation-emitting semiconductor chip, wherein a side surface of the cover body is inclined to the top surface of the carrier. Furthermore, a method for producing such a radiation-emitting component is specified.

Radiation-emitting component and method for producing a radiation-emitting component

The present invention relates to an LED backlighting system comprising a substrate, an optoelectronic semiconductor chip assembly, a reflector and a diffuser element. The optoelectronic semiconductor chip assembly is disposed on an upper side of the substrate. The reflector has a through-hole that extends between a lower opening on an underside of the reflector and an upper opening on an upper side of the reflector. The reflector is disposed on the upper side of the substrate so that the underside of the reflector is facing the upper side of the substrate. The optoelectronic semiconductor chip assembly is disposed in the through-hole of the reflector. The diffuser element has an upper side and an underside. The diffuser element is disposed above the upper side of the reflector so that the underside of the diffuser element is facing the upper side of the reflector.

LED backlighting system

A light-emitting semiconductor component may include a conversion layer, a radiation surface, and a plurality of adjacently arranged emission regions configured to be operated separately, individually and/or in groups. The conversion layer may be arranged downstream of the emission regions in the direction of radiation of the emission regions. The emission regions may be configured to emit primary radiation of a first wavelength range into the conversion layer. The conversion layer may be configured to convert at least a portion of the primary radiation into secondary radiation of a second wavelength range. Mixed radiation is configured to be emitted from the light-emitting semiconductor component at the radiation surface. The mixed radiation may include primary radiation and secondary radiation. A probability that primary radiation travelling from the emission region to the radiation surface is converted into secondary radiation may vary along the radiation surface by a maximum factor of 2.

Light-emitting semiconductor component

A semiconductor light source includes at least one first emission unit, at least one second emission unit, and an optics, wherein the optical system has an inner region that converges radiation from the first emission unit, the optical system has an outer region that expands radiation from the second emission unit, a first light emission region of the inner region completely covers the first emission unit when viewed in plan view, and at least partially covers the second emission unit, a second light emission region of the outer region is partially or completely beside the second emission unit when viewed in plan view, and the inner region and the outer region have differently shaped light entry regions.

Semiconductor light source

An optoelectronic component includes a light emitter including a multiplicity of segments, wherein each segment of the light emitter includes a multiplicity of image points configured to emit light, and an optical element configured to image light emitted by the light emitter into a target region, light emitted by the individual segments of the light emitter is superimposed in the target region, the optical element is subdivided into a number of segments corresponding to a number of segments of the light emitter, each segment of the optical element is respectively arranged over a segment of the light emitter, and the segments of the optical element are respectively configured as double-sided aspherical lenses.

Optoelectronic component

An optoelectronic component may include at least one semiconductor chip for emitting electromagnetic radiation, a conversion element, and an optical element. The conversion element may at least partially convert primary radiation emitted by the semiconductor chip(s) into secondary radiation where the conversion element is arranged downstream of the semiconductor chip(s) in the emission direction and is arranged on the semiconductor chip(s). The optical element may be arranged downstream of the conversion element in the emission direction and where the conversion element is subdivided into individual portions.

Optoelectronic component, a module having at least two optoelectronic components, and a method for producing an optoelectronic component

A projection optical unit that images electromagnetic radiation emitted by an optoelectronic semiconductor chip includes a first lens element, a second lens element, wherein the two lens elements each include a first light-refracting surface and a second light-refracting surface located opposite the first light-refracting surface, the second light-refracting surface of the first lens element faces the first light-refracting surface of the second lens element, and the four light-refracting surfaces each include an asphere-shaped surface section such that the respective surface section forms an aspherical lens.

Projection optical unit, optoelectronic semiconductor chip, optoelectronic illumination system, camera, terminal

An optoelectronic component includes a carrier, wherein the carrier includes a surface, reflective barriers are formed over the surface of the carrier, the reflective barriers divide the surface of the carrier into pixels, each pixel respectively includes at least one optoelectronic semiconductor chip arranged on the surface of the carrier, the optoelectronic semiconductor chip is configured to emit electromagnetic radiation, the optoelectronic semiconductor chip includes an upper side, the upper side faces away from the surface of the carrier, and a reflective covering is arranged on the upper side of the optoelectronic semiconductor chip.

A lens that spreads light from a point light source includes a light entry side having a first Fresnel structure, a light exit side having a second Fresnel structure different from the first Fresnel structure, a section plane located entirely between the first and second Fresnel structures so that the lens is flat, and a central axis as an optical axis perpendicular to the section plane, wherein a height of Fresnel rings of the first Fresnel structure, referred to the section plane, increases in the direction away from the central axis, the Fresnel rings of the first Fresnel structure each have an entry surface facing towards the central axis and a deflecting surface facing away from the central axis, and Fresnel rings of the second Fresnel structure each have a mirror surface facing towards the central axis and an exit surface facing away from the central axis.

Lens and lamp having a lens

An optoelectronic component includes a light emitter including a multiplicity of image points configured to emit light, and an optical element configured to guide light emitted by the light emitter into a target region, wherein a lower side facing toward the light emitter of the optical element is subdivided into four quadrants, each quadrant includes a Fresnel structure having a multiplicity of ridges extending along concentric annular arcs, the ridges of the Fresnel structure in each quadrant are respectively curved around a center shifted relative to a midpoint of the lower side of the optical element, and the center in each quadrant is arranged at a corner of the lower side of the optical element.

An optoelectronic lighting device that illuminates a scene to be captured as an image includes a pixelated emitter including a plurality of light emitting pixels that illuminate a scene to be captured as an image, and a driving device configured to individually drive the pixels depending on at least one parameter to illuminate the scene to be recorded with a predetermined illuminance distribution.

Optoelectronic lighting device, method of illuminating a scene, camera and mobile terminal

A lighting device includes a plurality of semiconductor light sources, the semiconductor light sources being configured to generate different light radiations; and an optical element arranged downstream of the semiconductor light sources, the optical element including on a side facing away from the semiconductor light sources a structure constituted of truncated pyramids.

Lighting device

An illumination device includes a radiation-emitting optoelectronic component and Fresnel optics including a Fresnel structure having annular ridges and annular grooves, wherein the ridges are configured as closed rings, the ridges and the grooves enclose an optical midaxis of the Fresnel structure, at least one first section of a ridge has a different shape in a predetermined angle range in relation to the midaxis than a second section of the ridge in a second angle range, and the ridges of the Fresnel structure include an inner face and an outer face in cross section through a plane of the midaxis, the inner face facing toward the midaxis in the radial direction, the outer face facing away from the midaxis in the radial direction, the outer face of at least one ridge having different angles in relation to the midaxis in two predetermined angle ranges in relation to the midaxis.

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Wuppertal, Germany

Ulrich Streppel