Commissariat a L'energie Atomique Et Aux Energies Alternatives

Stmicroelectronics (Crolles 2) Sas

Stmicroelectronics S.a.

Airbus Operations (s.a.s.)

Stmicroelectronics (Rousset) Sas

Ulrich Soupremanien

Thomas Skotnicki

Stephane Monfray

Xavier Baillin

Stéphane Monfray

Emmanuel Ollier

Emmanuel Rolland

Helga Szambolics

Sebastien Quenard

Olivier Verseux

Olga Kokshagina

Haykel Ben Jamaa

Christophe Maitre

Amandine Jouve

Gérard Delette

Lina Laifa

Maryline Roumanie

Marc Bohnke

Léana Ciobanu

DBC type structure, comprising an insulating support () coated with at least one conductive zone () able to receive an electronic device, the conductive zone () being in contact with the support (), the insulating support incorporating means for thermal smoothing of the heat peak released by the component, these means comprising a cavity filled with a phase change material.

DBC structure using a support incorporating a phase change material

An electronic device includes an electronic component and a protective shield including a phase change material having a phase change temperature of between 20&#xb0; C. and 90&#xb0; C., an antivibration gel having hyperelastic and/or viscoelastic behavior at 20&#xb0; C., and a separation barrier positioned so as to separate the phase change material and the antivibration gel. The antivibration gel is positioned, at least partly, in contact with the electronic component, and has a thermal conductivity of greater than 1 W/m&#xb7;K at 20&#xb0; C.

Protected electronic device

A power conversion device includes an enclosure containing one or more drops of a liquid. A capacitive electret transducer is coupled to the enclosure. In response to applied heat at a heating surface, the liquid vaporizes and then condenses on a flexible membrane of the capacitive electret transducer. The flexible membrane is displaced in response to the vaporization-condensation and the capacitive electret transducer generates an output current.

Device for converting thermal energy into electrical energy

Production of a heat absorption device comprising a first face intended to be in contact with a hot source and a second face opposite to the first face, a network of cells filled with a first phase change material being arranged between the first face, a passage between cells being filled with at least one second phase change material different from the first phase change material.

Composite heat absorption device and method for obtaining same

A device for converting heat energy into electrical energy including cells, the cells including: a first cavity with one wall for contacting a heat source; a second cavity with one wall for contacting a cold source; a primary channel between the first cavity and the second cavity transporting a fluid as liquid drops, the primary channel providing transport of liquid fluid drops from the second cavity to the first cavity; at least one secondary channel between the first cavity and the second cavity transporting the fluid as a gas; a piezoelectric material provided in one of the cavities; and a fluid as a liquid and gas contained within the cell.

Device for recovering and converting heat energy into electrical energy

An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKgKat a 25&#xb0; C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.

Electronic component and fabrication process of this electronic component

Growing community of inventors

Saint Marcellin, France

Ulrich Soupremanien