Robert Boschgmbh

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Würth Elektronik Gmbh &Co. Kg

Ulrich Schaaf

Andreas Kugler

Alexander Neumann

Johanna May

Stefan Apelt

Frieder Sundermeier

Adrian Severin Matusek

Karl-Friederich Becker

Jan Kostelnik

Jana Hoffmann

A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Method for manufacturing camera modules and a camera module array

A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.

Method for manufacturing an electronic assembly

In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

Method for producing an electronic subassembly

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Kaisersbach, Germany

Ulrich Schaaf