Infineon Technologies Ag

Ulrich Nolten

Johannes Uhlig

Arthur Unrau

Marco Ludwig

Jens Krugmann

Regina Nottelmann

Sven Hagebusch

Karsten Wolff

A power semiconductor module includes: a substrate with a metallization layer attached to a dielectric insulation layer and a semiconductor body mounted to the metallization layer; a housing at least partly enclosing the substrate and having sidewalls and a cover that at least partly covers an opening formed by the sidewalls and has a flexible portion; and a press-on pin having arranged on the substrate or semiconductor body. A first end of the press-on pin faces the substrate or semiconductor body and extends towards the cover such that a second end of the press-on pin contacts the flexible portion of the cover. The substrate in an area vertically below the press-on pin has a first spring constant kin a vertical direction that is perpendicular to a top surface of the substrate. The flexible portion of the cover has a second spring constant k, where 0.5*k≤k≤5*k.

Power semiconductor module, method for assembling a power semiconductor module and housing for a power semiconductor module

A housing for a power semiconductor module includes sidewalls and a top that includes a first surface extending in a first horizontal plane and a second surface opposite and in parallel to the first surface, a plurality of openings of a first kind, each of the plurality of openings of the first kind including a first through hole extending through the top from the first surface to the second surface, and a plurality of openings of a second kind, each of the plurality of openings of the second kind comprising a second through hole extending through the top from the first surface to the second surface. Each of the plurality of openings of the first kind includes a collar or sleeve. Each of the plurality of openings of the second kind includes a trench or indentation arranged adjacent to and forming a closed loop around the respective second through hole.

Housing, semiconductor module comprising a housing and method for producing a housing

A housing for a power semiconductor module arrangement includes sidewalls and a lid. The lid includes a first layer of a first material having a plurality of openings, and second layer of a second material that is different from the first material. The second layer completely covers a bottom surface of the first layer. The second layer includes a plurality of protrusions, each protrusion extending into a different one of the plurality of openings of the first layer such that each of the plurality of openings is completely covered by one of the protrusions.

Housing, semiconductor module and methods for producing the same

A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

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Rüthen, Germany

Ulrich Nolten