Robert Boschgmbh

Ulrich Goebel

Walter Roethlingshoefer

Werner Nitschke

Klaus Voigtlaender

Gert Jakob

Botho Ziegenbein

Dietrich Bergfried

Roland Gerstner

Albert-Andreas Hoebel

Werner Gruenwald

Kurt Weiblen

Thomas Wiesa

Rolf Becker

Roland Schmid

Manfred Moser

Hans-Heinrich Maue

Ralf Haug

Franz Schmich

Elmar Huber

Annette Seibold

Richard Muehlheim

Bernd Maihoefer

Andreas Thomae

Peter Schaedler

Martin Zywietz

Lothar Schmidt

Gerald Hopf

Martin Holland

Michael Krapp

Andreas Fischer

Uwe Schaub

Reinhold Danner

Juergen Schwaiger

Stefan Rupprecht

Gerhard Zucker

Walter Rothlingshofer

Roland Feucht

Herbert Boehm

Joerg Offterdinger

Markus-Alexander Schweiker

An easily producible and easily installable ignition mechanism for restraint devices in a vehicle includes an ignition capsule, in which at least one ignition element and its contact pins are fixed. Into the ignition capsule a pedestal can be set, in which a carrier arrangement having circuit elements is arranged. Spring elements are present, by which contact is established between circuit elements and contact pins of the ignition element when the pedestal is set into the ignition capsule.

Ignition mechanism for a restraining device in a vehicle

Pressure sensor having at least one connector element arranged flush

Process for producing a ceramic multilayer substrate

In a method for producing a pressure sensor, a ceramic plate is joined to a shaped ceramic part. The shaped ceramic part has a depression. Around the depression there is provided a thick-layer paste which does not completely surround the depression. As a result, the air can escape from the depression during firing and a subatmospheric pressure can thus be enclosed in the depression.

Method for producing a pressure sensor

Acceleration sensor

In a method, which permits the application of porous plates inside of multilayered ceramic structures, dense regions are formed in the edge areas of the porous plates. The dense regions prevent fluids, gases and vapors from penetrating to the inside of the multilayered ceramic structure.

Method of manufacturing multilayered ceramic structures

In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.

Method for producing a multilayer circuit

A connection arrangement with PC board features a ceramic substrate glued to a base plate of metal, used as a cooling body. Islands have been hollowed out of the adhesive layer and are filled with thermally conductive paste. Particularly effective thermal dissipation is possible in the area of the islands filled with thermally conductive paste, so that the islands are always disposed underneath components with great energy or heat dissipation.

Connection arrangement with PC board

A support for sensor elements, especially temperature, throughflow or chemical sensors, comprises a supporting element composed of a ceramic material and having at least one throughgoing opening, a thin ceramic foil arranged on the supporting element so as to cover the opening to support a sensor element in the region of the opening.

Support for sensors, and sensor provided therewith

An electrical circuit unit, particularly for motor vehicles, features a grounded housing (1) and a printed circuit board (2) which, for protection against incoming and outgoing radiation of electrical noise, is short-circuited at high frequencies to the grounded housing. For this purpose, a noise suppression capacitor (6) on the PC board (2) is connected in series to a second capacitor. This second capacitor is formed by a metallized surface (8) on the board (2) and a metal-filled adhesive, as a first plate, a metal inner surface (11) of the housing (1) as a second plate, and an intermediate passivation or eloxal layer serving as a dielectric (13). The metal-filled adhesive acts to electrically bridge most of the gap between the metallized surface (8) and the housing surface (11), thereby capacitively coupling the metal-filled adhesive to the housing (1) and increasing the capacitance.

Electric circuit unit

The holder (1) for an electronic component (20), especially a hybrid module, is preferably a unitary plastic element having an elongated base plate (2) formed with openings (14) therein to permit insertion of terminal pins or lugs (21) projecting from the component therethrough. Two holder arms (30) project from the base plate, the holder arms having module support portions (3) and oppositely projecting posts (4). The posts fit into receiving openings (26, 27) of a printed circuit board, which receiving openings having a spacing (S) which is greater than the distance (D) between the posts so that, upon insertion of the posts in the openings the arms (30) will tilt towards each other, thus clamping a module, typically in card or board form, between the module support (3) of the arms. The holder can also form a transport holder for the module, by forming, for example, in the module a notch spaced from the upper edge, and engaging the notch (22) with a projecting rim (9) formed on the upper ends of the support portions (3) of the arms, the notch being so spaced that the terminal lugs or pins (21) then just fit into the openings (14) in the base plate, thereby protecting the pins against damage.

Holder system for free-standing electronic components, especially hybrid

Voltage divider in thin- or thick-film technology

Growing community of inventors

Reutlingen, Germany

Ulrich Goebel