Sensirion Ag

Invensense, Inc.

Ulrich Bartsch

Rene Hummel

Chung-Hsien Lin

Tsung Lin Tang

Chia Min Lin

Wang Shen Su

Ralph Steiner-Vanha

Marion Hermersdorf

Felix Mayer

Markus Graf

Matthias Streiff

Pascal Gerner

Martin Winger

Stephan Braun

René Hummel

Samuel Fuhrer

Ralph Steiner Vanha

Alexander Lochbaum

Matthias Studer

Silvio Graf

Réne Hummel

Thomas Brugger

Jens Hornung

Marcel Pluess

Stefan Knobelspies

Ueli Schoen

Matthias Böller

Markus Dankerl

Lin Chia Min

Su Wang Shen

Tang Tsung Lin

Lin Chung-Hsien

A gas generator comprises a compartment confined by a casing configured to hold an active material generating a target gas in response to thermal activation, and a heater structure configured and arranged to heat the active material for generating the target gas. The heater structure is arranged outside the compartment and heats the active material from at least two sides.

Gas generator

A sensor module comprises a master sensor unit for sensing a first environmental parameter, a slave sensor unit for sensing a second environmental parameter, a common substrate on which the master sensor unit and the slave sensor unit are mounted, and a digital bus interface for a communication between the master sensor unit and the slave sensor unit. The master sensor unit comprises a non-volatile memory for storing calibration data and configuration data of the master sensor unit and the slave sensor unit. The master sensor unit is embodied as a first chip, and the slave sensor unit is embodied as a second chip. Such sensor module is compact, robust and versatile.

Sensor module

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

Pressure sensor

A method for fabrication of a sensor device () for measuring a parameter of a test substance, comprising: i) providing a substrate; ii) arranging on its front side a structured first protection layer (); iii) arranging on the substrate with the structured first protection layer () a stack including first and second electrodes (), a sacrificial layer between the first and second electrodes (); and iv) etching in an etching step from the back side through the substrate such as to remove material of the semiconductor substrate and the sacrificial layer. The present invention also relates to such a sensor device ().

Method for fabrication of a sensor device

Pressure sensor with deformable membrane and method of manufacture

A sensor chip comprises a substrate () with a front side () and a back side (), and an opening () in the substrate () reaching through from its back side () to its front side (). A stack () of dielectric and conducting layers is arranged on the front side () of the substrate (), a portion of which stack () spans the opening () of the substrate (). Contact pads () are arranged at the front side () of the substrate () for electrically contacting the sensor chip. A sensing element () is arranged on the portion of the stack () spanning the opening () on a side of the portion facing the opening ().

Sensor chip

The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighboring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.

Sensor chip and method for manufacturing a sensor chip

The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighbouring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.

Method for manufacturing a sensor chip

Growing community of inventors

Meilen, Switzerland

Ulrich Bartsch