Telefonaktiebolaget Lm Ericsson (publ)

Ulf I Holmberg

Karl-Erik Leeb

Bj&ouml;rn Gudmund Gudmundsson

A method and means for arranging heat transport, i.e. cooling or heating, of electrical components, are disclosed. Embodiments of the invention show how one or several flexible tubes (,) are arranged in connection with units (,) comprising electrical components. The units (,) can be enclosed in cabinets (,). The tube (,) can be arranged in a zigzag pattern around the units (,) and pressurized by a fluid from a combined pump and heat exchanger (,). The pressure expands the wall of the tube (,), thus creating thermal contact with the units (,). By flowing fluid in the tube (,) heat can be transported from or to the units (,). Tubes (,) arranged in several cabinets (,) can be connected, either in series or in parallel.

Method and apparatus for arranging heat transport

The present invention relates to a method of manufacturing a heat transfer device, particularly a heat transfer device for cooling electronic components, having a metal plate and a plurality of cylindrical metal pins which are packed relatively densely on the plate and extend perpendicularly therefrom. The inventive method comprises the steps of cleaning the plate (1) and the pins (2) and treating the same with fluxing agent; loading the pins (2) into a pin holding device (4, 7) and affixing the pins by means of said device in mutually radial positions and holding the pins at an axial distance above the plate (1). Solder material (13) is applied to the plate (1) and caused to melt. The pins (2) are then lowered simultaneously down into the molten solder (13) and the solder is caused to solidify while maintaining the pins (2) in their fixed radial positions, whereafter the holder device (4, 7) is removed. The invention also relates to a tool in the form of a holding device intended for use in the manufacture of a heat transfer device and for carrying out the method.

Method of manufacturing heat transfer devices, and a tool for carrying

In a device for contacting shielded conductors, surrounded by shield and ground planes, a clamping means is disposed to press contact means connected to the conductors against each other as well as shield and ground planes which face each other and surround the contact means. A pad of an electrically conducting, elastic material is arranged between the clamping means and one of the contact means. The pad covers the contact area between the contact means and is in contact with the surrounding ground planes to form an electrically closed enclosure of the contact means.

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Jarfalla, Sweden

Ulf I Holmberg