Silex Microsystems Ab

Ulf Erlesand

Edvard Kälvesten

Method of making through-substrate-vias in glass substrates includes providing a first substrate on which a plurality of needles protruding vertically from the substrate are made; providing a second substrate made of glass; locating the substrates adjacent each other such that the needles on the first substrate face the second substrate; applying heat to a temperature where the glass softens, by heating the glass or the needle substrate or both; applying a force such that the needles on the first substrate penetrate into the glass to provide impressions in the glass; and finally, removing the first substrate and providing material filling the impressions in the second substrate made of glass. A device includes a silicon substrate having a cavity in which a MEMS component is accommodated, and a cap wafer made of a material having a low dielectric constant, and through substrate vias of metal, is bonded to the silicon substrate.

Through substrate vias and device

A substrate-through electrical connection () for connecting components on opposite sides of a substrate, and a method for making same. The connection includes a substrate-through via made from substrate material ('). There is a trench () provided surrounding the via, the walls of the trench being coated with a layer of insulating material () and the trench () is filled with conductive or semi-conductive material (). A doping region () for threshold voltage adjustment is provided in the via material in the surface of the inner trench wall between insulating material () and the material (&#x2032;) in the via. There are contacts (&#x2033;) to the via on opposite sides of the substrate, and a contact () to the conductive material () in the trench () so as to enable the application of a voltage to the conductive material ().

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Osterskar, Sweden

Ulf Erlesand