Schott Ag

Ulf Brauneck

Joseph S Hayden

Edgar Pawlowski

Ulrich Fotheringham

Bernd Woelfing

Ralf Biertuempfel

Petra Auchter-Krummel

Dietrich Mund

Bernd Wölfing

Ralf Biertümpfel

Frank Fleissner

Volker Seidemann

Ulrich Jeschkowski

Thomas Strohmaier

Wolfgang Erbach

A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.

Method for producing optoelectronic components, and products produced thereby

The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

Method for packaging components

The invention is based on the object of providing UV interference filters having improved long-term stability. For this purpose, a method for producing a dielectric transmission interference filter is provided, in which an alternating layer system having the constituents magnesium fluoride, lead fluoride and antimony oxide is produced on a substrate by co-evaporation. After deposition, the substrate is subjected to heat treatment and irradiated with UV light in order to stabilize the layer system.

Interference filter and method for producing it

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Gross-Umstadt, Germany

Ulf Brauneck